EP3SE260H780I4L vs EP3SE260H780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4L EP3SE260H780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V (nominal)
Process Technology 65 nm —
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount (flip-chip BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperature na Operasyon Industrial, -40C to +85C —
Tindminan RoHS Compliant (lead-free) Compliant (lead-free per datasheet)
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel PS, FPP, JTAG with EPCS/EPCQ
Pin/Package 780-BBGA, FCBGA (flip-chip) —
LABs/CLBs — 10,200
Total RAM Bits — 16,672,768 (16.7 Mbit)
Packhaging — 780-ball FCBGA (HBGA 33x33 mm)
Speed Grade — C4 (middle/slow tier)
Temperature ng Junction na Operasyon — 0C to +85C (commercial)
Level ng MSL — [DATA_NEEDED: MSL level]
Transceivers — Up to 24 multi-gigabit transceivers
Memory Interface — DDR3, DDR2, QDRII+, RLDRAM II controllers

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