EP3SE260H780I4L vs EP3SE260H780I4LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4L disebabkan oleh Intel dan EP3SE260H780I4LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780I4L | EP3SE260H780I4LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix III E (Enhanced) | EP3SE260 |
| Logic Elements | 255,000 | 255,000 LE |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| Jenis Pemasangan | Surface Mount (flip-chip) | — |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| Suhu Operasi | Industrial, -40C to +85C | -40C to +100C |
| Status RoHS | Compliant (lead-free) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Series | — | Stratix III Enhanced |
| Adaptive Logic Modules (ALMs) | — | 102,000 ALM |
| Embedded Memory | — | 15.90 Mbit |
| DSP Blocks | — | 304 |
| 18x18 Multipliers | — | 840 |
| User I/O | — | 488 |
| PLLs | — | 8 (4 fractional + 4 general-purpose) |
| Speed Grade | — | -4 |
| Temperature Grade | — | Industrial (I) |
| Kemasan | — | 780-ball FineLine BGA (HBGA) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel / Active Serial |