EP3SE260H780I4L vs EP3SE260H780I4LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780I4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4L EP3SE260H780I4LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III E (Enhanced) EP3SE260
Logic Elements 255,000 255,000 LE
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V —
Process Technology 65 nm 65 nm low-power CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) —
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperature na Operasyon Industrial, -40C to +85C -40C to +100C
Tindminan RoHS Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Series — Stratix III Enhanced
Adaptive Logic Modules (ALMs) — 102,000 ALM
Embedded Memory — 15.90 Mbit
DSP Blocks — 304
18x18 Multipliers — 840
User I/O — 488
PLLs — 8 (4 fractional + 4 general-purpose)
Speed Grade — -4
Temperature Grade — Industrial (I)
Packhaging — 780-ball FineLine BGA (HBGA)
Configuration Method — JTAG / Passive Serial / Fast Passive Parallel / Active Serial

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