EP3SE50F484I4LN vs EP3SE50F484I4LG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I4LN disebabkan oleh Intel dan EP3SE50F484I4LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE50F484I4LG EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE50F484I4LN EP3SE50F484I4LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix III E Stratix III (Enhanced)
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory 5.76 Mbit (estimated from 47.5K LE family) —
User I/O Count 296 296
Process Node 65 nm —
Core Voltage (VCCINT) 0.9 V —
Auxiliary Voltage (VCCAUX) 1.1 V —
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) —
Kemasan 484-ball FBGA (FineLine BGA) 484-ball FBGA / FCBGA
Pin/Pitch 484 balls, 1.0 mm pitch —
Suhu Operasi -40C to +100C (industrial I4 grade) —
Configuration SRAM-based (external flash/EPCS required) —
Status RoHS Compliant (LN suffix indicates lead-free) Compliant
Lead-Free Yes (LF / N suffix indicates lead-free) —
Transceivers 0 (F484 package does not include transceiver banks) —
PLL Count Up to 12 (estimated for Stratix III E family) —
DSP Blocks (18x18 Multipliers) [DATA_NEEDED: DSP block count] —
Design Tool Quartus II (legacy, support via Altera/Intel subscription) —
Series — Stratix III E
Adaptive Logic Modules (ALMs) — 19,000
LABs/CLBs — 1,900
Total Embedded Memory — 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source)
Number of DSP Blocks — 104 (18x18 multipliers)
Number of PLLs — 8
Core Supply Voltage (Vccint) — 0.86 V to 1.15 V (1.1 V nominal)
Gambaran Suhu Operasi — -40C to +100C (Industrial, TJ)
Jenis Pemasangan — Surface Mount (SMD/SMT)
Packaging — Tray
Process Technology — 40 nm CMOS
Configuration Interface — Passive Serial / Fast Passive Parallel / JTAG
Bitstream Encryption — 256-bit AES

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