EP3SE50F484I4LN vs EP3SE50F484I4LG مقایسه
مقایسه دقیق کنار به کنار EP3SE50F484I4LN توسط Intel و EP3SE50F484I4LG توسط Intel. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
Intel
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG ⚠ آخرین فرصت خریدمقایسه مشخصات
| پارامتر | EP3SE50F484I4LN | EP3SE50F484I4LG |
|---|---|---|
| برند | Intel | Intel |
| دسته‌بندی | FPGA & CPLD | FPGA & CPLD |
| وضعیت چرخه عمر | Obsolete | آخرین فرصت خرید |
| Family | Stratix III E | Stratix III (Enhanced) |
| Logic Elements (LE) | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5.76 Mbit (estimated from 47.5K LE family) | — |
| User I/O Count | 296 | 296 |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 0.9 V | — |
| Auxiliary Voltage (VCCAUX) | 1.1 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) | — |
| بسته‌بندی | 484-ball FBGA (FineLine BGA) | 484-ball FBGA / FCBGA |
| Pin/Pitch | 484 balls, 1.0 mm pitch | — |
| دمای کاری | -40C to +100C (industrial I4 grade) | — |
| Configuration | SRAM-based (external flash/EPCS required) | — |
| وضعیت RoHS | Compliant (LN suffix indicates lead-free) | Compliant |
| Lead-Free | Yes (LF / N suffix indicates lead-free) | — |
| Transceivers | 0 (F484 package does not include transceiver banks) | — |
| PLL Count | Up to 12 (estimated for Stratix III E family) | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Design Tool | Quartus II (legacy, support via Altera/Intel subscription) | — |
| Series | — | Stratix III E |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| LABs/CLBs | — | 1,900 |
| Total Embedded Memory | — | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) |
| Number of DSP Blocks | — | 104 (18x18 multipliers) |
| Number of PLLs | — | 8 |
| Core Supply Voltage (Vccint) | — | 0.86 V to 1.15 V (1.1 V nominal) |
| محدوده دمای کاری | — | -40C to +100C (Industrial, TJ) |
| نوع نصب | — | Surface Mount (SMD/SMT) |
| Packaging | — | Tray |
| Process Technology | — | 40 nm CMOS |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | 256-bit AES |