EP3SL200H780C2 vs EP3SL200H780I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C2 disebabkan oleh Intel dan EP3SL200H780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C2 | EP3SL200H780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | — |
| LABs / CLBs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | 488 |
| Kemasan | 780-BBGA, FCBGA | — |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Jenis Pemasangan | Surface Mount | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Process Node | 65 nm | — |
| Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Voltage - I/O | [DATA_NEEDED: I/O voltage] | — |
| DSP Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | 384 |
| Transceivers | [DATA_NEEDED: transceiver count for H780] | — |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| Voltage - Core Supply | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Speed Grade | — | I4 (industrial) |
| Suhu Hubungan Operasi | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |