EP3SL200H780C2 vs EP3SL200H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2 sa pamamagitan ng Intel at EP3SL200H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2 | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | — |
| LABs / CLBs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | 488 |
| Packhaging | 780-BBGA, FCBGA | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Process Node | 65 nm | — |
| Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Voltage - I/O | [DATA_NEEDED: I/O voltage] | — |
| DSP Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | 384 |
| Transceivers | [DATA_NEEDED: transceiver count for H780] | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| Voltage - Core Supply | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Speed Grade | — | I4 (industrial) |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |