EP3SL200H780C4L vs EP3SL200H780I4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C4L disebabkan oleh Intel dan EP3SL200H780I4LN disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C4L | EP3SL200H780I4LN |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | Intel (formerly Altera) | Intel / Altera (now Intel PSG) |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | — |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | — |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | I4 (Industrial, mid-speed grade) |
| Suhu Operasi | 0C to 85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Status RoHS | Compliant | RoHS Compliant (lead-free) |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III L (Low-Power) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Jenis Pemasangan | — | Surface Mount |
| Kemasan / Case | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Aras MSL | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |