EP3SL200H780C4L vs EP3SL200H780I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C4L sa pamamagitan ng Intel at EP3SL200H780I4LN sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C4L | EP3SL200H780I4LN |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Manufacturer | Intel (formerly Altera) | Intel / Altera (now Intel PSG) |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | — |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | — |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | I4 (Industrial, mid-speed grade) |
| Temperature na Operasyon | 0C to 85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Tindminan RoHS | Compliant | RoHS Compliant (lead-free) |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III L (Low-Power) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Uri ng Pagpapasok | — | Surface Mount |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Level ng MSL | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |