EP3SL340H1152C3N vs EP3SE110F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL340H1152C3N disebabkan oleh Intel dan EP3SE110F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL340H1152C3N EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Family Stratix III L Stratix III E
Logic Elements 337,500 —
User I/O Count 744 —
Number of LABs/CLBs 13,500 —
Total RAM Bits 18,822,144 8,936,448
Supply Voltage (Core) 1.1 V —
Process Node 65 nm —
Suhu Operasi 0C to +85C (Commercial) 0 °C to 85 °C (commercial)
Kemasan 1152-BBGA, FCBGA —
Jenis Pemasangan Surface Mount Surface Mount
Speed Grade 3 C3
Configuration Memory SRAM (volatile) —
Bilangan Pin 1152 —
Status RoHS Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Series — Stratix III
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Process Technology — 65 nm TSMC
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Pemasangan — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Jenis Ingatan — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

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