EP3SL50F780C3 vs EP3SL50F780C2N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3 disebabkan oleh Intel dan EP3SL50F780C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL50F780C3 EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL50F780C3 EP3SL50F780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III L (low-power) —
Series Stratix III Stratix III L
Logic Elements 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 —
User I/Os 488 488
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Suhu Operasi 0C to +85C (Commercial) 0 °C to 85 °C (Commercial)
Speed Grade 3 C2
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Status RoHS Compliant Compliant
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Tingkat sensitiviti Air Nama (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Device Type — FPGA (Field Programmable Gate Array)
Configurable Logic Blocks (LABs) — 1,900
Embedded Memory — 2,184,192 bits
Kemasan — 780-ball FBGA (FCBGA)
Internal Fabric Frequency (max) — 800 MHz
Process Technology — 65 nm
Core Supply Voltage — 0.9 V
Jenis Pemasangan — Surface Mount
Status Lingkungan Hidup — Not Recommended for New Designs (NRND)

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