EP3SL50F780C3 vs EP3SL50F780C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3 sa pamamagitan ng Intel at EP3SL50F780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL50F780C3 | EP3SL50F780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L (low-power) | — |
| Series | Stratix III | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | 488 |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 °C to 85 °C (Commercial) |
| Speed Grade | 3 | C2 |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 2,184,192 bits |
| Packhaging | — | 780-ball FBGA (FCBGA) |
| Internal Fabric Frequency (max) | — | 800 MHz |
| Process Technology | — | 65 nm |
| Core Supply Voltage | — | 0.9 V |
| Uri ng Pagpapasok | — | Surface Mount |
| Katayuan ng Lifecycle | — | Not Recommended for New Designs (NRND) |