EP3SL50F780I3 vs EP3SL50F780I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780I3 disebabkan oleh Intel dan EP3SL50F780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel
EP3SL50F780I4 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL50F780I3 | EP3SL50F780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-BBGA, FCBGA |
| Process Technology | 65 nm | — |
| Core Voltage | Selectable 1.1 V / 0.9 V | 0.9 V |
| Speed Grade | I3 (industrial, third-fastest bin) | I4 (fastest) |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Manufacturer | — | Intel (formerly Altera) |
| Process Node | — | 40 nm TSMC |
| Embedded Memory Bits | — | 2,184,192 |
| Embedded Memory Blocks | — | M20K blocks |
| DSP 18x18 Multipliers | — | 244 |
| User I/Os | — | 488 |
| PLLs | — | 8 |
| Global Clock Networks | — | 28 |
| Configuration Method | — | Serial, parallel, or JTAG |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Hard IP | — | PCIe Gen2 hard IP blocks |