EP3SL50F780I3 vs EP3SL50F780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I3 sa pamamagitan ng Intel at EP3SL50F780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel
EP3SL50F780I4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL50F780I3 | EP3SL50F780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-BBGA, FCBGA |
| Process Technology | 65 nm | — |
| Core Voltage | Selectable 1.1 V / 0.9 V | 0.9 V |
| Speed Grade | I3 (industrial, third-fastest bin) | I4 (fastest) |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Manufacturer | — | Intel (formerly Altera) |
| Process Node | — | 40 nm TSMC |
| Embedded Memory Bits | — | 2,184,192 |
| Embedded Memory Blocks | — | M20K blocks |
| DSP 18x18 Multipliers | — | 244 |
| User I/Os | — | 488 |
| PLLs | — | 8 |
| Global Clock Networks | — | 28 |
| Configuration Method | — | Serial, parallel, or JTAG |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Hard IP | — | PCIe Gen2 hard IP blocks |