EP3SL70F780I3 vs EP3SL50F780I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I3 disebabkan oleh Intel dan EP3SL50F780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL70F780I3 | EP3SL50F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | 47,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Suhu Operasi | -40 C to +100 C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I3 (industrial) | I3 (industrial, third-fastest bin) |
| Core Voltage | 1.1 V | Selectable 1.1 V / 0.9 V |
| Process Node | 65 nm | — |
| Kemasan | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch |
| Package Code | BGA780,28X28,40 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Series | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 1,900 |
| User I/O Pins | — | 488 |
| Total Memory Bits | — | 2,106 Kbit (M9K + M144K) |
| Transceiver Channels | — | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) |
| Process Technology | — | 65 nm |
| Lead Free | — | Yes |
| Vertical Migration | — | Drop-in to EP3SL70 in 780-FBGA package |