EP3SL70F780I3N vs EP3SL70F780I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I3N disebabkan oleh Intel dan EP3SL70F780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL70F780I3N | EP3SL70F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | 1.1 V |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Hubungan Operasi | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| Suhu Operasi | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Kemasan | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |