EP3SL70F780I3N vs EP3SL70F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3N sa pamamagitan ng Intel at EP3SL70F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL70F780I3N | EP3SL70F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | 1.1 V |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| Temperature na Operasyon | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Packhaging | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |