EPF10K200SBC356-3 vs EPF10K200SBC356-2X Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200SBC356-3 disebabkan oleh Intel dan EPF10K200SBC356-2X disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K200SBC356-3 EPF10K200SBC356-2X
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family FLEX 10K FLEX 10K
Device Type FPGA - Field Programmable Gate Array —
Typical Gates 200,000 —
Logic Elements (Cells) 9,984 —
Logic Array Blocks (LABs) 1,248 1248
Embedded Array Blocks (EABs) 12 —
Total EAB RAM 98,304 bits —
User I/Os 470 (package exposes 274 bonded-out) —
Flip-Flops 4,992 —
Process Technology 0.22 um CMOS, 4 metal layers CMOS 0.22 µm
Core Supply Voltage 2.375 V to 2.625 V —
Propagation Delay 0.4 ns —
Internal Performance (fmax) 250 MHz —
Suhu Operasi 0 C to 70 C (Commercial) 0 °C to +70 °C (commercial)
Kemasan PBGA-356 (35 x 35 mm, 1.27 mm pitch) 356-LBGA (35x35 mm, 1.27 mm pitch)
Jenis Pemasangan Surface Mount Surface Mount
Configuration Mode Passive Serial / Passive Parallel / JTAG —
MultiVolt I/O 2.5 V / 3.3 V / 5.0 V —
Logic Family CMOS —
Status RoHS [DATA_NEEDED: rohs status] —
Series — FLEX-10KS
Logic Elements / Cells — 9984
Approximate Gate Count — 200,000
User I/O Count — 274
Tegangan Pemberi Arus — 2.375 V to 2.625 V (core)
Propagation Delay (typ.) — 0.4 ns
Speed Grade — -2
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
Configuration Method — SRAM-based, requires external configuration device (EPC2/EPC8)
In-System Programmability — Yes (via JTAG or serial interface)

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