EPF10K200SBC356-3 vs EPF10K200SBC356-2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-3 sa pamamagitan ng Intel at EPF10K200SBC356-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X NrndPagsanggunian na paghahambing
| Parametro | EPF10K200SBC356-3 | EPF10K200SBC356-2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10K | FLEX 10K |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | — |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | CMOS 0.22 µm |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| Temperature na Operasyon | 0 C to 70 C (Commercial) | 0 °C to +70 °C (commercial) |
| Packhaging | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | — |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| User I/O Count | — | 274 |
| Volte ng Pagbibigay | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Speed Grade | — | -2 |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| Configuration Method | — | SRAM-based, requires external configuration device (EPC2/EPC8) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |