EPF10K200SBC356-3 vs EPF10K200SBC356-2X 比較
詳細並排比較 EPF10K200SBC356-3 由 Intel 與 EPF10K200SBC356-2X 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X Nrnd規格比較
| 參數 | EPF10K200SBC356-3 | EPF10K200SBC356-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Family | FLEX 10K | FLEX 10K |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | — |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | CMOS 0.22 µm |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| 工作溫度 | 0 C to 70 C (Commercial) | 0 °C to +70 °C (commercial) |
| 封裝 | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | — |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| User I/O Count | — | 274 |
| 供應電壓 | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Speed Grade | — | -2 |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| Configuration Method | — | SRAM-based, requires external configuration device (EPC2/EPC8) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |