K4RCH046VM-2CLP vs K4RHE086VB-BCWM Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4RCH046VM-2CLP disebabkan oleh Samsung Electronics dan K4RHE086VB-BCWM disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4RCH046VM-2CLP | K4RHE086VB-BCWM |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR5 SDRAM | DDR5 SDRAM |
| Density | 32 Gb | 24 Gb |
| Organisasi | 4G x 4 | 2G x 8 |
| Kadar Data | 6400 Mbps | 5600 Mbps |
| Tegangan Pemberi Arus | 1.1 V | 1.1 V |
| Suhu Operasi | 0C to 85C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 78-FBGA | 82 FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration | x4 component | x8 |
| Antaramuka | DDR5 (SSTL-style low-voltage signaling) | DDR5 (JEDEC) |
| Family Speed Range (Samsung DDR5) | up to 7200 Mbps | — |
| Family Density Range (Samsung DDR5) | 16 Gb to 32 Gb | — |
| Power Efficiency vs DDR4 | Approx. 30% greater | — |
| Product Status (per distributor listing) | Sample / Active supply via distribution | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |
| Package Height | — | [DATA_NEEDED: package height] |