LPC55S28JBD64E vs LPC5526JBD64E Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci LPC55S28JBD64E disebabkan oleh NXP Semiconductors dan LPC5526JBD64E disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | LPC55S28JBD64E | LPC5526JBD64E |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | Arm Cortex-M33 | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-Bit |
| Frekuensi Klock Maksimum | 150 MHz | 150 MHz |
| Flash Memory Size | 512 KB (512K x 8) | — |
| SRAM Size | 128 KB | — |
| Series | LPC55S2x | — |
| Kemasan | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Security Features | TrustZone, PUF-based security (S-series) | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC (built-in) |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature range] |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Tingkat sensitiviti Air Nama (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Maximum Time at Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| Status RoHS | Compliant (e3 lead-free finish) | Compliant |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Flash Memory | — | 256KB (256K x 8) |
| RAM Size | — | [DATA_NEEDED: SRAM size] |
| Security Feature | — | ARM TrustZone |
| NMI Input | — | Yes, with selection of sources |
| Max Time At Peak Reflow | — | 30 s |
| Status Lingkungan Hidup | — | Active |