M29F160FB55N3F2 vs M29W160EB70N3E Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci M29F160FB55N3F2 disebabkan oleh Micron Technology dan M29W160EB70N3E disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Micron Technology
M29F160FB55N3F2 M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 Obsolete
Micron Technology
M29W160EB70N3E M29W160EB70N3E - 16Mbit NOR Flash 70ns 48-TSOP | Micron

M29W160EB70N3E - 16Mbit NOR Flash 70ns 48-TSOP | Micron

M29W160EB70N3E ✓ Aktif

Pengandingan Spesifikasi

Parametr M29F160FB55N3F2 M29W160EB70N3E
Merek Micron Technology Micron Technology
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Obsolete Aktif
Jenis Ingatan Parallel NOR Flash FLASH - NOR
Density 16777 kbits (16 Mbit) —
Organisasi 1 Mword x 16 bits / 2 Mbyte x 8 bits 2M x8 / 1M x16
Number of Words 1000 k —
Bits per Word 16 bits —
Access Time 55 ns 70 ns
Tegangan Pemberi Arus 5 V —
Boot Block Architecture Bottom Boot Block —
Suhu Operasi -40 to +125 C -40C to +125C
Antaramuka Parallel Parallel
Package Type 48-TSOP —
Jenis Pemasangan Surface Mount Surface Mount
Termination Finish Lead-free (F2 suffix) —
Program/Erase Controller Embedded byte/word program algorithms —
Block Protection Hardware boot block protection —
Status RoHS Compliant (lead-free) [DATA_NEEDED: RoHS status]
Speed Grade (from MPN) 55 (55 ns) —
Saiz Ingatan — 16 Mbit (2M x8, 1M x16)
Supply Voltage (VCC) — 2.7 V to 3.6 V
Programming Time — 10 us (typical)
Cell Type — SLC NOR
Kemasan / Case — 48-TFSOP (0.724 in, 18.40 mm width)
Packaging — Tray
Speed Grade — -70
FBGA Code — N/A (TSOP package)
Aras MSL — [DATA_NEEDED: moisture sensitivity level]

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