MC9S08AW60MPUE557 vs MC9S08AW48CPUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AW60MPUE557 disebabkan oleh NXP Semiconductors dan MC9S08AW48CPUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S08AW60MPUE557 | MC9S08AW48CPUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (enhanced S08) | — |
| Lebar Bus Data | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| Tegangan Pemberi Arus Operasi | 2.7 V to 5.5 V | — |
| I/O Pins | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa | — |
| Kemasan | 64-LQFP (10x10 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| ADC | [DATA_NEEDED: number of channels and resolution] | — |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| Serial Interfaces | SCI, SPI, I2C (per NXP family description) | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | Single-wire background debug mode (BDM) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 48 KB (48K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tray |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |