MC9S08AW60MPUE557 vs MC9S08AW48CPUE Karşılaştırma

Ayrıntılı yan yana karşılaştırma MC9S08AW60MPUE557 tarafından NXP Semiconductors ve MC9S08AW48CPUE tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MC9S08AW60MPUE557 MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 ✓ Aktif
NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd

Özellik Karşılaştırması

Parametre MC9S08AW60MPUE557 MC9S08AW48CPUE
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Aktif NRND
Core Architecture HCS08 (enhanced S08) —
Veri Bus Genişliği 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
İşletim Besleme Gerilimi 2.7 V to 5.5 V —
I/O Pins 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa —
Paket 64-LQFP (10x10 mm) —
Montaj Türü Surface Mount Surface Mount
İşletim Sıcaklığı [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
ADC [DATA_NEEDED: number of channels and resolution] —
PWM Channels [DATA_NEEDED: PWM channel count] —
Serial Interfaces SCI, SPI, I2C (per NXP family description) —
Debug Interface Single-wire Background Debug Mode (BDM) Single-wire background debug mode (BDM)
RoHS Durumu [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
CPU Speed — 40 MHz
Program Memory Type — FLASH
Program Memory Size — 48 KB (48K x 8)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Package Type — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2)
Package Height — 1 mm
Instruction Set — HC08 with added BGND instruction
Packaging — Tray
Yaşam Döngüsü Durumu — NRND (Not Recommended for New Designs)

Dökümanlar & Kaynaklar

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