MC9S08DN32AMLC vs MC9S08DV60AMLF Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DN32AMLC disebabkan oleh NXP Semiconductors dan MC9S08DV60AMLF disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08DN32AMLC | MC9S08DV60AMLF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | — |
| Number of I/O | 25 | 53 GPIO + 1 input-only |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | 8-channel 10-bit (per datasheet family) |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Kemasan | 32-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Suhu Operasi | -40 C to +125 C | -40C to +125C |
| Tegangan Pemberi Arus | [DATA_NEEDED: VDD range] | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Status RoHS | Compliant | ROHS3 Compliant |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | Single-wire BDM |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Processor | — | HCS08 (enhanced HC08 with BGND) |
| Core Size | — | 8-bit |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 3 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| Timers | — | Multiple TPM (per datasheet family) |