MC9S12DT256CMPV vs MC9S12XDT512MAA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DT256CMPV disebabkan oleh NXP Semiconductors dan MC9S12XDT512MAA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ Aktif
Pengandingan Spesifikasi
| Parametr | MC9S12DT256CMPV | MC9S12XDT512MAA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Kemasan | LQFP-112 | 80-QFP (14x14 mm), Square, Gull Wing |
| Kiraan Pin | 112 | — |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | — |
| PWM Channels | 8 channels | — |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Jenis Pemasangan | Surface Mount (LQFP, gull-wing) | Surface Mount |
| Status RoHS | Compliant (per NXP product page) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: supply voltage range] |
| Suhu Operasi | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Boson Bebas | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |