MC9S12DT256CMPV vs MC9S12XDT512MAA Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DT256CMPV sa pamamagitan ng NXP Semiconductors at MC9S12XDT512MAA sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ Nakahanda
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

Pagsanggunian na paghahambing

Parametro MC9S12DT256CMPV MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo NRND
Core Architecture HCS12 (S12) 16-bit CISC —
Bus Frequency Up to 50 MHz —
Program Flash 256 KB —
RAM 12 KB —
EEPROM 4 KB —
Packhaging LQFP-112 80-QFP (14x14 mm), Square, Gull Wing
Bilang ng Pin 112 —
Operating Voltage 5.0 V (4.5 V to 5.5 V) —
Temperature Grade Automotive (-40C to +125C) —
ADC 2 x 8-channel 10-bit —
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel (ECT) —
SCI (UART) Interfaces 2 —
SPI Interfaces 2 —
CAN Modules 1 x msCAN (CAN 2.0A/B) —
GPIO (Approx.) 20 discrete digital I/O lines —
Debug Interface Background Debug Mode (BDM) —
Uri ng Pagpapasok Surface Mount (LQFP, gull-wing) Surface Mount
Tindminan RoHS Compliant (per NXP product page) —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
Volte ng Pagbibigay — [DATA_NEEDED: supply voltage range]
Temperature na Operasyon — -40C to +125C (TA)
Packaging Method — Tray
Wala sa Halogen — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita