MCF5281CVM80 vs MCF5280CVM80J Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5281CVM80 disebabkan oleh NXP Semiconductors dan MCF5280CVM80J disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MCF5281CVM80 | MCF5280CVM80J |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Core Processor | ColdFire V2 | ColdFire V2 |
| Core Size | 32-Bit | 32-Bit Single-Core |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | ROMless (0 KB internal flash, code via external bus) |
| RAM Size | 64 KB (64K x 8) | — |
| Number of I/O | 142 | [DATA_NEEDED: GPIO count from datasheet] |
| Tegangan Pemberi Arus | 3.3 V | — |
| Kemasan / Case | 256-MAPBGA (17x17 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART | CANbus, Ethernet (10/100 MAC), I2C, SPI, UART |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, PWM, WDT, 16-bit timers, external memory controller |
| Oscillator Type | External | — |
| Suhu Operasi | -40C to +85C (industrial) | -40C to +105C (TJ, industrial grade) |
| Temperature Grade | Industrial | Industrial |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | LBGA | — |
| Package Shape | SQUARE | — |
| Aras MSL | 3 | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (Pb-free reflow profile) |
| Part Status | Not For New Designs (NRND) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | MCF528x (ColdFire V2) |
| Maximum CPU Clock | — | 80 MHz |
| Program Memory Type | — | ROMless (external flash required) |
| Kemasan | — | 256-MAPBGA (17x17 mm) |
| Ethernet | — | 10/100 MAC integrated (MII/RMII interface to external PHY) |
| CAN | — | CAN 2.0 controller integrated |
| Debug Interface | — | JTAG / BDM (Background Debug Mode) |
| Lead-Free Finish | — | Yes (Matte Tin, SAC solder compatible) |