MCF5281CVM80 vs MCF5280CVM80J Karşılaştırma

Ayrıntılı yan yana karşılaştırma MCF5281CVM80 tarafından NXP Semiconductors ve MCF5280CVM80J tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MCF5281CVM80 MCF5281CVM80 - 80MHz ColdFire V2 MCU 256KB Flash | NXP

MCF5281CVM80 - 80MHz ColdFire V2 MCU 256KB Flash | NXP

MCF5281CVM80 Nrnd
NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete

Özellik Karşılaştırması

Parametre MCF5281CVM80 MCF5280CVM80J
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu NRND Obsolete
Core Processor ColdFire V2 ColdFire V2
Core Size 32-Bit 32-Bit Single-Core
Maximum Clock Speed 80 MHz —
Program Memory Size 256 KB (256K x 8) Flash ROMless (0 KB internal flash, code via external bus)
RAM Size 64 KB (64K x 8) —
Number of I/O 142 [DATA_NEEDED: GPIO count from datasheet]
Besleme Gerilimi 3.3 V —
Paket / Kas 256-MAPBGA (17x17 mm) —
Montaj Türü Surface Mount Surface Mount (BGA)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART CANbus, Ethernet (10/100 MAC), I2C, SPI, UART
Peripherals DMA, LVD, POR, PWM, WDT DMA, PWM, WDT, 16-bit timers, external memory controller
Oscillator Type External —
İşletim Sıcaklığı -40C to +85C (industrial) -40C to +105C (TJ, industrial grade)
Temperature Grade Industrial Industrial
Terminal Form BALL —
Number of Terminals 256 —
Package Code LBGA —
Package Shape SQUARE —
MSL Seviyesi 3 3 (per JEDEC J-STD-020, typical for MAPBGA)
RoHS Durumu [DATA_NEEDED: rohs status] Compliant (Pb-free reflow profile)
Part Status Not For New Designs (NRND) —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Series — MCF528x (ColdFire V2)
Maximum CPU Clock — 80 MHz
Program Memory Type — ROMless (external flash required)
Paket — 256-MAPBGA (17x17 mm)
Ethernet — 10/100 MAC integrated (MII/RMII interface to external PHY)
CAN — CAN 2.0 controller integrated
Debug Interface — JTAG / BDM (Background Debug Mode)
Lead-Free Finish — Yes (Matte Tin, SAC solder compatible)

Dökümanlar & Kaynaklar

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