MCF5281CVM80 vs MCF5280CVM80J Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCF5281CVM80 sa pamamagitan ng NXP Semiconductors at MCF5280CVM80J sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MCF5281CVM80 | MCF5280CVM80J |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Core Processor | ColdFire V2 | ColdFire V2 |
| Core Size | 32-Bit | 32-Bit Single-Core |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | ROMless (0 KB internal flash, code via external bus) |
| RAM Size | 64 KB (64K x 8) | — |
| Number of I/O | 142 | [DATA_NEEDED: GPIO count from datasheet] |
| Volte ng Pagbibigay | 3.3 V | — |
| Packhaging / Kaso | 256-MAPBGA (17x17 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART | CANbus, Ethernet (10/100 MAC), I2C, SPI, UART |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, PWM, WDT, 16-bit timers, external memory controller |
| Oscillator Type | External | — |
| Temperature na Operasyon | -40C to +85C (industrial) | -40C to +105C (TJ, industrial grade) |
| Temperature Grade | Industrial | Industrial |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | LBGA | — |
| Package Shape | SQUARE | — |
| Level ng MSL | 3 | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant (Pb-free reflow profile) |
| Part Status | Not For New Designs (NRND) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | MCF528x (ColdFire V2) |
| Maximum CPU Clock | — | 80 MHz |
| Program Memory Type | — | ROMless (external flash required) |
| Packhaging | — | 256-MAPBGA (17x17 mm) |
| Ethernet | — | 10/100 MAC integrated (MII/RMII interface to external PHY) |
| CAN | — | CAN 2.0 controller integrated |
| Debug Interface | — | JTAG / BDM (Background Debug Mode) |
| Lead-Free Finish | — | Yes (Matte Tin, SAC solder compatible) |