S9S08QD4J2MSC vs S9S08QD4J2MSCR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08QD4J2MSC disebabkan oleh NXP Semiconductors dan S9S08QD4J2MSCR disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ AktifPengandingan Spesifikasi
| Parametr | S9S08QD4J2MSC | S9S08QD4J2MSCR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | — |
| Kemasan | 8-SOIC (0.154", 3.90 mm width) | 8-SOIC (0.154 inch, 3.90 mm width) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +125C (automotive grade) | -40 C to +125 C |
| AEC-Q100 Qualification | Qualified | — |
| Bilangan Pin | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: VDD range] | 2.7 V to 5.5 V |
| ADC | On-chip ADC (channel count per datasheet) | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | On-chip timer(s) | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | — |
| Low-Power Modes | STOP and WAIT | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |