S9S08QD4J2MSC vs S9S08QD4J2MSCR Karşılaştırma

Ayrıntılı yan yana karşılaştırma S9S08QD4J2MSC tarafından NXP Semiconductors ve S9S08QD4J2MSCR tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Aktif
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Aktif

Özellik Karşılaştırması

Parametre S9S08QD4J2MSC S9S08QD4J2MSCR
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Aktif Aktif
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
Paket 8-SOIC (0.154", 3.90 mm width) 8-SOIC (0.154 inch, 3.90 mm width)
Montaj Türü Surface Mount Surface Mount
İşletim Sıcaklığı -40C to +125C (automotive grade) -40 C to +125 C
AEC-Q100 Qualification Qualified —
Pin Sayısı 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
Besleme Gerilimi [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
ADC On-chip ADC (channel count per datasheet) 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers On-chip timer(s) TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS Durumu [DATA_NEEDED: RoHS status] Compliant
Core — HCS08
Instruction Set Architecture — CISC (68 HC08 with added BGND)
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Program Memory Type — Flash
Program Memory Size — 4 KB (4K x 8)
Packaging — Tape & Reel (TR)
I/O Pins — 4
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints

Dökümanlar & Kaynaklar

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