S9S08QD4J2MSC vs S9S08QD4J2MSCR 比較

詳細並排比較 S9S08QD4J2MSC 由 NXP Semiconductors 與 S9S08QD4J2MSCR 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ 啟用中
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ 啟用中

規格比較

參數 S9S08QD4J2MSC S9S08QD4J2MSCR
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
封裝 8-SOIC (0.154", 3.90 mm width) 8-SOIC (0.154 inch, 3.90 mm width)
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +125C (automotive grade) -40 C to +125 C
AEC-Q100 Qualification Qualified —
腳位數 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
供應電壓 [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
ADC On-chip ADC (channel count per datasheet) 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers On-chip timer(s) TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Core — HCS08
Instruction Set Architecture — CISC (68 HC08 with added BGND)
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Program Memory Type — Flash
Program Memory Size — 4 KB (4K x 8)
Packaging — Tape & Reel (TR)
I/O Pins — 4
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints

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