S9S08QD4J2MSCR vs MC9S08QD4CSC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08QD4J2MSCR disebabkan oleh NXP Semiconductors dan MC9S08QD4CSC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | S9S08QD4J2MSCR | MC9S08QD4CSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Tegangan Pemberi Arus | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Suhu Operasi | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | Tube |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| Status RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frekuensi Klock Maksimum | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Life Cycle Stage | — | End of Life (per NXP product page) |