S9S08QD4J2MSCR vs MC9S08QD4CSC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S9S08QD4J2MSCR sa pamamagitan ng NXP Semiconductors at MC9S08QD4CSC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | S9S08QD4J2MSCR | MC9S08QD4CSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Tapus ng Buhay |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Temperature na Operasyon | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Packhaging | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | Tube |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| Tindminan RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maksimum na Taktiko ng Oras | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Life Cycle Stage | — | End of Life (per NXP product page) |