S9S08QD4J2MSCR vs MC9S08QD4CSC 比較
詳細並排比較 S9S08QD4J2MSCR 由 NXP Semiconductors 與 MC9S08QD4CSC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | S9S08QD4J2MSCR | MC9S08QD4CSC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 停產終止 |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| 供應電壓 | 2.7 V to 5.5 V | 3.3 V / 5 V |
| 工作溫度 | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| 封裝 | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | Tube |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS 狀態 | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| 最大時脈頻率 | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Life Cycle Stage | — | End of Life (per NXP product page) |