S9S12DG25F0MPVE vs MC9S12A64CPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S12DG25F0MPVE disebabkan oleh NXP Semiconductors dan MC9S12A64CPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
S9S12DG25F0MPVE ✓ AktifPengandingan Spesifikasi
| Parametr | S9S12DG25F0MPVE | MC9S12A64CPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-Bit | 16-Bit |
| CPU Speed | 25 MHz | — |
| Program Memory Type | FLASH | FLASH |
| Program Memory Size | 256 KB (256K x 8) | 64KB (64K x 8) |
| EEPROM Size | 4 KB (4K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size in KB] | [DATA_NEEDED: SRAM size] |
| Number of I/O | 91 | [DATA_NEEDED: GPIO count] |
| Connectivity | CANbus, I²C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| ADC | 2x 8-channel, 10-bit | — |
| Timers | 8-channel IC/OC Enhanced Capture Timer | — |
| Suhu Operasi | -40°C to +125°C | [DATA_NEEDED: operating temperature range] |
| Kemasan / Case | 112-LQFP (20 x 20 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Automotive Qualification | AEC-Q100 Qualified | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Architecture | — | CISC |
| Frekuensi Klock Maksimum | — | 25 MHz |
| Tegangan Pemberi Arus | — | 2.5V/5V |
| Kemasan | — | 112-LQFP (20x20 mm) |
| Kiraan Pin | — | 112 |
| External Bus | — | 8-bit narrow mode supported |
| System Module | — | SIM (System Integration Module) |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |