S9S12DG25F0MPVE vs MC9S12A64CPVE Perbandingan
Perbandingan bersamaan detil S9S12DG25F0MPVE dari NXP Semiconductors dan MC9S12A64CPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
S9S12DG25F0MPVE ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | S9S12DG25F0MPVE | MC9S12A64CPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-Bit | 16-Bit |
| CPU Speed | 25 MHz | — |
| Program Memory Type | FLASH | FLASH |
| Program Memory Size | 256 KB (256K x 8) | 64KB (64K x 8) |
| EEPROM Size | 4 KB (4K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size in KB] | [DATA_NEEDED: SRAM size] |
| Number of I/O | 91 | [DATA_NEEDED: GPIO count] |
| Connectivity | CANbus, I²C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| ADC | 2x 8-channel, 10-bit | — |
| Timers | 8-channel IC/OC Enhanced Capture Timer | — |
| Suhu Kerja | -40°C to +125°C | [DATA_NEEDED: operating temperature range] |
| Paket / Case | 112-LQFP (20 x 20 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Automotive Qualification | AEC-Q100 Qualified | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Architecture | — | CISC |
| Frekuensi Bawah Maximum | — | 25 MHz |
| Tegangan Pemuat | — | 2.5V/5V |
| Paket | — | 112-LQFP (20x20 mm) |
| Jumlah Pin | — | 112 |
| External Bus | — | 8-bit narrow mode supported |
| System Module | — | SIM (System Integration Module) |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |