S9S12DG25F0MPVE vs MC9S12A64CPVE 比較
詳細並排比較 S9S12DG25F0MPVE 由 NXP Semiconductors 與 MC9S12A64CPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
S9S12DG25F0MPVE ✓ 啟用中規格比較
| 參數 | S9S12DG25F0MPVE | MC9S12A64CPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-Bit | 16-Bit |
| CPU Speed | 25 MHz | — |
| Program Memory Type | FLASH | FLASH |
| Program Memory Size | 256 KB (256K x 8) | 64KB (64K x 8) |
| EEPROM Size | 4 KB (4K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size in KB] | [DATA_NEEDED: SRAM size] |
| Number of I/O | 91 | [DATA_NEEDED: GPIO count] |
| Connectivity | CANbus, I²C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| ADC | 2x 8-channel, 10-bit | — |
| Timers | 8-channel IC/OC Enhanced Capture Timer | — |
| 工作溫度 | -40°C to +125°C | [DATA_NEEDED: operating temperature range] |
| 封裝 / 外殼 | 112-LQFP (20 x 20 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Automotive Qualification | AEC-Q100 Qualified | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Architecture | — | CISC |
| 最大時脈頻率 | — | 25 MHz |
| 供應電壓 | — | 2.5V/5V |
| 封裝 | — | 112-LQFP (20x20 mm) |
| 腳位數 | — | 112 |
| External Bus | — | 8-bit narrow mode supported |
| System Module | — | SIM (System Integration Module) |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| 生命週期狀態 | — | NRND (Not Recommended for New Designs) |