SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci SPC5643LFF2MMM1R disebabkan oleh NXP Semiconductors dan SPC5642AF2MVZ3 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktif
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Aktif

Pengandingan Spesifikasi

Parametr SPC5643LFF2MMM1R SPC5642AF2MVZ3
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) —
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
Gambaran Suhu Operasi -40 °C to +125 °C (automotive grade) -40°C to +105°C
Kemasan 257-LFBGA / MAPBGA 14x14 mm —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) —
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) —
Lead-Free / RoHS Compliant (lead-free BGA) —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Tegangan Pemberi Arus — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Number of I/O Pins — [DATA_NEEDED: Number of I/O Pins]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

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