SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Karşılaştırma

Ayrıntılı yan yana karşılaştırma SPC5643LFF2MMM1R tarafından NXP Semiconductors ve SPC5642AF2MVZ3 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktif
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Aktif

Özellik Karşılaştırması

Parametre SPC5643LFF2MMM1R SPC5642AF2MVZ3
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Aktif Aktif
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) —
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
İşletim Sıcaklığı Aralığı -40 °C to +125 °C (automotive grade) -40°C to +105°C
Paket 257-LFBGA / MAPBGA 14x14 mm —
Montaj Türü Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) —
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) —
Lead-Free / RoHS Compliant (lead-free BGA) —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Besleme Gerilimi — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Number of I/O Pins — [DATA_NEEDED: Number of I/O Pins]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

Dökümanlar & Kaynaklar

Tüm Ürünleri Gözden Geçir BOM Oluştur Teklif İsteyin