Intel

EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera

Name: EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera
Brand: Intel
SKU: EP1S10F780C7

MPN: EP1S10F780C7 ✗ Akhir Hayat

1.5 V Vdss LVTTL, LVCMOS, LVDS, SSTL, HSTL (per bank) Rds(on) 780-ball FC-FBGA (29 × 29 mm, 1.0 mm pitch) Package C7 Speed

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MOQ: 1 |

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EP1S10F780C7 Ringkasan

The Intel / Altera EP1S10F780C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded RAM, and 426 user I/O pins in a 780-ball Fine-Pitch Ball Grid Array (FC-FBGA) measuring 29 mm × 29 mm with a 1.0 mm ball pitch. According to the Stratix device family data sheet, the device operates from a 1.5 V core supply, supports up to 420.17 MHz internal operation, and is offered in the commercial 0 °C to 85 °C temperature grade as denoted by the 'C7' speed-grade suffix.

An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory, and high-speed transceiver functions after PCB fabrication, instead of committing to a fixed ASIC design. The Stratix family sits in the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are commonly deployed for DSP pipelines, custom protocol bridging, ASIC prototyping, and high-throughput parallel processing where fixed-function processors are too slow or inflexible.

Key features of the EP1S10F780C7 include 10570 logic elements, 426 maximum user I/O, and 920448 RAM bits distributed across TriMatrix memory blocks. The device also embeds DSP blocks for high-throughput arithmetic, supports LVDS I/O signalling, and offers a dedicated configuration interface (Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, and JTAG). It is implemented on a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O.

Architecturally, Stratix devices combine a fine-grained logic element fabric, embedded SRAM, dedicated DSP blocks, and high-speed I/O elements with on-die termination. The 'S' in the prefix marks the device as the Stratix series (rather than Stratix GX / Stratix II). This architecture suits applications that demand deterministic latency, parallel datapath processing, and flexible I/O standard assignment across multiple banks.

Typical applications for the EP1S10F780C7 include high-performance DSP acceleration, ASIC prototyping, telecom baseband processing, industrial control and motor control, and test-and-measurement instrumentation. The large pin count and RAM density make it well suited to multi-channel data acquisition systems, video processing engines, and high-speed serial protocol bridging.

When designing with this FPGA, engineers must supply the configuration device or JTAG chain, define I/O bank voltages for each bank, and ensure the PCB land pattern matches the 780-ball FC-FBGA 29 × 29 mm 1.0 mm-pitch layout. Thermal management should be considered because the large BGA can dissipate several watts in sustained logic-switching workloads.

This page synthesizes Stratix family specifications, current distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not collated in any single manufacturer document.

Pilihan pengganti yang segera untuk EP1S10F780C7 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera EP1S10F780C7 (sama faktor bentuk dan kaki) — berbeza dalam Package, Operating Temperature, Process Technology, Speed Grade, DSP Blocks.

EP1S10F780C5

Intel

Package: 780-ball FineLine BGA (FC-FBGA)

Process Technology: 0.13 micrometer, all-layer copper CMOS, SRAM

Speed Grade: C5