10AX090N2F45I2LG - Arria 10 GX FPGA, 900K LE, BGA
MPN: 10AX090N2F45I2LG ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for 10AX090N2F45I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory | 59234304 bits |
| Embedded Multipliers | 768 |
| Operating Temperature Grade | Industrial |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Package | 1932-BBGA, FCBGA |
| Terminal Form | Ball |
| Number of Terminals | 1932 |
| Package Code | BGA |
| Package Shape | Square |
| Mounting Type | Surface Mount |
| Ordering Part Number | 10AX090N2F45I2LG |
| Logic Technology | FPGA programmable logic |
| Reconfigurable Architecture | Yes |
| Typical Application | Communications, video, industrial, and test systems |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_qualified |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
| Conflict Minerals Status | unknown |
10AX090N2F45I2LG [data_needed: package dimensions] Pin Configuration Guide
Complete pinout information for 10AX090N2F45I2LG ([data_needed: package dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package dimensions] package pinout diagram for 10AX090N2F45I2LG](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for 10AX090N2F45I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F45I2LG is suitable for 6 applications: Communications Infrastructure, Industrial Video Processing, High-Performance Embedded Computing, Test and Measurement Equipment, Machine Vision and Imaging, Custom Accelerator Platform.
Communications Infrastructure
10AX090N2F45I2LG fits communications infrastructure designs that need substantial programmable capacity for parallel datapaths, protocol processing, packet buffering, and custom interfaces. The verified device provides 900000 logic elements, 59234304 bits of embedded memory, and 768 multipliers, allowing multiple processing blocks to operate concurrently. It can be configured to implement line-card functions, framing, filtering, traffic management, or interface adaptation. The industrial -40 C to +85 C range supports equipment deployed in uncontrolled enclosures and factory environments. Because the supplied data does not specify transceiver count, I/O count, voltage rails, or supported interface standards, the complete interface and timing design must be validated against Intel documentation before implementation.
Recommended
Industrial Video Processing
10AX090N2F45I2LG is suitable for industrial video-processing systems that require real-time pixel manipulation, frame buffering, image enhancement, and deterministic control. Its 900000 logic elements provide capacity for parallel processing pipelines, while 59234304 bits of embedded memory support line, frame, and coefficient storage. The 768 multipliers can accelerate filtering, convolution, scaling, and other arithmetic-intensive operations. The industrial -40 C to +85 C specification is useful for factory equipment and other environments with wide ambient-temperature variation. The FPGA is a programmable processing platform, so sensor interfaces, external memory, clock recovery, and output interfaces remain system-level design decisions. Exact supported I/O, memory interfaces, and timing values require manufacturer documentation.
Recommended
High-Performance Embedded Computing
10AX090N2F45I2LG can serve as the reconfigurable processing core in a high-performance embedded system. The 900000 logic elements support control, interface adaptation, state machines, and custom accelerators, while 59234304 bits of embedded memory can hold data, lookup tables, and temporary buffers. The 768 embedded multipliers are useful for fixed-point algorithms such as filtering, transforms, and sensor-fusion calculations. The 1932-ball FCBGA/BGA package is appropriate for a dense, high-performance PCB, but it requires controlled impedance, robust power distribution, and advanced assembly capability. The industrial -40 C to +85 C grade supports demanding embedded installations. Confirm power architecture, configuration storage, clocking, and thermal limits from the full device documentation.
Recommended
Test and Measurement Equipment
10AX090N2F45I2LG is a strong candidate for test and measurement equipment requiring deterministic processing, flexible acquisition paths, and custom analysis functions. The 900000 logic elements allow simultaneous implementation of trigger logic, control, data formatting, and user-defined algorithms. The 59234304 bits of embedded memory support waveform buffers and intermediate data, while the 768 multipliers can accelerate numeric processing. Its programmable nature enables instrument functionality to change through configuration rather than a PCB redesign. The industrial -40 C to +85 C range supports test systems used in varied environmental conditions. Converter interfaces, data rates, clocking, accuracy, and measurement-specific I/O must be confirmed; those parameters are not included in the supplied verified data.
Recommended
Machine Vision and Imaging
10AX090N2F45I2LG can support machine-vision and imaging systems that combine sensor acquisition, image preprocessing, object detection, and real-time control. The 900000 logic elements provide the capacity to implement parallel pixel pipelines, while 59234304 bits of embedded memory can hold image lines, processing windows, and lookup data. The 768 multipliers accelerate spatial filters, convolution, and arithmetic transforms. The programmable architecture allows designers to optimize data paths for specific cameras, resolutions, and algorithms. The industrial -40 C to +85 C grade is appropriate for factory imaging equipment. Sensor interface standards, high-speed I/O, external memory bandwidth, package routing, and power integrity must be validated using the complete Arria 10 GX documentation and board-level simulation.
Recommended
Custom Accelerator Platform
10AX090N2F45I2LG can function as a custom accelerator platform for algorithms that benefit from spatial parallelism and deterministic hardware execution. The 900000 logic elements support a broad combination of control and datapath logic, while 59234304 bits of embedded memory provide local storage for streaming data, coefficients, and intermediate results. The 768 multipliers support fixed-point convolution, correlation, filtering, and other compute-heavy operations. This makes the device relevant to specialized analytics, communications, aerospace-related processing, and laboratory systems. The 1932-ball BGA package enables a dense implementation but creates substantial routing and assembly requirements. Actual performance depends on clocking, data movement, memory hierarchy, tool configuration, and thermal design. Those engineering values require verification beyond the supplied product summaries.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F45I2LG — comparison, design guidance, and compliance information.
Selection Guide
Key Differentiators
- Large verified programmable capacity (vs 10AX066K2F40I1SG)
- Industrial temperature grading (vs 10AX090N2F45E2SG)
- High-ball-count fine-pitch package (vs 10AX090N2F40I2LG)
Design Notes
Power integrity is critical for 10AX090N2F45I2LG because an FPGA power budget depends on configuration, logic utilization, clock rates, multiplier activity, memory usage, and I/O switching. The supplied data does not provide voltage or power values, so do not infer them from the family name. Use the Intel power-estimation tools with the final configuration, derive the required rails, and confirm decoupling, sequencing, current limits, and transient response from the complete device documentation. Treat any board-level power number as an estimate until validated by measurement.
The 1932-ball BGA/FCBGA package requires a manufacturer-qualified land pattern and a carefully controlled PCB stack-up. Use the official package drawing rather than deriving dimensions from a distributor description. Plan escape routing, via fields, power planes, and ground continuity before schematic freeze. Confirm via-in-pad rules, solder-mask definition, ball pitch, package warpage limits, and assembly-provider capability. The verified data establishes the ball count and package type but not the dimensions or recommended stack-up.
10AX090N2F45I2LG is specified for industrial operation from -40 C to +85 C, but that ambient range does not replace a junction-temperature analysis. Estimate power from the actual design configuration, then combine it with the package thermal model, PCB copper, airflow, enclosure conditions, and nearby heat sources. Provide thermal vias or copper spreading where the manufacturer package guidelines permit, and validate the solution under maximum clock, logic, multiplier, memory, and I/O activity. Exact thermal-resistance values are [DATA_NEEDED].
High-performance FPGA designs require controlled-impedance routing and disciplined power delivery. Route clocks and high-speed interfaces according to the selected interface standard, maintain ground references, minimize discontinuities, and use simulation or measurement to validate the complete channel. The supplied data does not state I/O count, supported I/O standards, transceiver count, or maximum frequencies, so those values must be obtained from the manufacturer datasheet before fixing the PCB constraints. Avoid selecting termination, routing width, or stack-up rules from generic BGA guidance alone.
Do not treat a similar Arria 10 order code as a drop-in FPGA without an exact ordering-code comparison and a complete compatibility review. Verify package and ball map, industrial temperature grade, speed grade, logic capacity, embedded memory, multipliers, I/O, transceivers, voltage, configuration interface, timing, and power. The provided search results did not identify a verified 1932-ball drop-in replacement. Keep the original PCB and firmware until Intel documentation, pinout review, timing closure, configuration, and board-level validation are complete.
Compliance Information
The supplied web data confirms an industrial temperature grade but does not provide verified RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statements. AEC-Q100 is shown as not_qualified because the supplied data does not establish automotive qualification; this does not assert a negative manufacturer declaration.
