M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
MPN: M7AFS600-2FG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $340.02 | $340.02 |
| 10 | $323.02 | $3,230.20 |
| 100 | $306.02 | $30,602.00 |
| 500 | $289.02 | $144,510.00 |
| 1,000 | $272.01 | $272,010.00 |
Drop-in alternatives for M7AFS600-2FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M7AFS600-FGG484I
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View Datasheet →M7AFS600-2FG484I Maximum Ratings & Electrical Characteristics
| Family | Fusion (Flash-Based FPGA) |
| System Gates | 600000 gates |
| Logic Elements (D Flip-Flops) | 110592 |
| User I/O | 172 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | Nonvolatile on-chip flash (retains program when powered off) |
| Live at Power-Up (LAPU) | Yes |
| Optional Processor Support | ARM CoreMP7 |
| Speed Grade | -2 |
| Operating Temperature | 0 to 70 C |
| Temperature Grade | Industrial (I suffix) |
| Package | 484-ball FBGA, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Packaging | Tray |
M7AFS600-2FG484I 484-ball fbga, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for M7AFS600-2FG484I (484-ball fbga, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-2FG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-2FG484I is suitable for 6 applications: Industrial Control and Automation, Secure / Tamper-Resistant Designs, Aerospace and Defense Subsystems, Embedded System Controllers, Bridge and Interface Logic, Medical and Instrumentation Equipment.
Industrial Control and Automation
The M7AFS600-2FG484I fits industrial control because its nonvolatile flash fabric comes up Live at Power-Up, so machine logic is active within microseconds of power application without waiting for external bitstream loading - critical for factory-floor controllers and safety-adjacent sequencing. With 600K system gates, 110,592 flip-flops, and 172 user I/Os, it integrates motor interface glue logic, sensor aggregation, and the optional ARM CoreMP7 soft processor on one chip. Placed on a 1.5V core with banked I/O rails, it drives standard industrial I/O levels while flash storage withstands the electrical noise of factory environments that can corrupt SRAM configuration.
Recommended
Secure / Tamper-Resistant Designs
Security-focused systems benefit from the M7AFS600-2FG484I because configuration is stored entirely in on-chip flash - no external configuration PROM ever exposes the bitstream on a readable bus. This eliminates the most common SRAM-FPGA cloning attack, where an adversary captures the configuration stream at boot. The 600K-gate fabric provides room for cryptographic state machines, authentication logic, and interface encryption, while the 172 user I/Os connect to secure sensors and enclosures. Live at Power-Up operation means protection logic is active before a host processor completes boot, closing a window that externally configured SRAM FPGAs cannot close.
Recommended
Aerospace and Defense Subsystems
Aerospace and defense designers choose the M7AFS600-2FG484I for flash-based instant-on behavior and single-chip configuration, reducing the part count and failure modes of externally programmed SRAM FPGAs. The 130-nm, 7-layer-metal flash process has a proven heritage in Microsemi (Microchip) radiation-tolerant product lines, and the same fabric architecture extends to the RTAX space family for programs needing an upgrade path. With 600K gates and 172 I/Os, the device implements telemetry framing, bus bridges, and payload interface logic; the optional ARM CoreMP7 soft processor hosts command-and-control firmware within the same nonvolatile fabric.
Recommended
Embedded System Controllers
As an embedded controller, the M7AFS600-2FG484I pairs the optional ARM CoreMP7 soft processor with 600K gates of custom fabric, replacing a discrete MCU plus FPGA two-chip solution. The CoreMP7 handles firmware tasks such as protocol stacks and housekeeping, while the fabric implements deterministic peripherals - custom timers, encoder interfaces, or high-speed data paths - that no off-the-shelf MCU provides. Because the design is stored in nonvolatile flash, the system boots instantly with no configuration device, and the 1.5V core keeps static power low for always-on control nodes. The 484-ball FBGA provides enough I/Os (172) for rich peripheral connectivity.
Recommended
Bridge and Interface Logic
The M7AFS600-2FG484I serves as protocol bridge logic between processors and custom peripherals, leveraging 172 user I/Os banked across the 484-ball FBGA for multi-voltage interfaces. The 110,592-flip-flop fabric absorbs bus-width conversion, clock-domain crossing FIFOs, and legacy-interface emulation (parallel buses, serial links) between modern SoCs and older boards. Flash configuration means the bridge is functional at power-up - important when host boot ROMs expect interface hardware to respond immediately. The -2 speed grade supports fabric clocking sufficient for most bridging tasks; verify closure with static timing analysis in Libero SoC for the fastest interfaces.
Recommended
Medical and Instrumentation Equipment
Medical diagnostics and laboratory instrumentation adopt the M7AFS600-2FG484I for its deterministic instant-on fabric and long-lifecycle flash FPGA platform. The 600K-gate capacity implements sensor front-end sequencing, filter accelerators, and display interface logic, while the ARM CoreMP7 soft processor runs calibration and housekeeping firmware on the same chip, shrinking board area in portable instruments. Nonvolatile configuration prevents the blank-FPGA fault mode during Brown-out events - a reliability consideration for devices that must resume correctly after power interruptions. The 1.5V core and banked I/O rails integrate cleanly with low-noise analog subsystems typical of measurement front ends.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-2FG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG484I | M7AFS600-2FGG484I | M7AFS600-1FG484I | M1AFS600-2FG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (1.0 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 (ProASIC3 family) |
| User I/O | 172 | 172 | 172 | 172 | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -2 | Standard | -2 | -1 | -2 (ProASIC3) |
| Configuration Memory | Nonvolatile on-chip flash | Nonvolatile on-chip flash | Nonvolatile on-chip flash | Nonvolatile on-chip flash | Nonvolatile on-chip flash (no Fusion analog blocks) |
| Mixed-Signal / Analog Features | Yes (Fusion mixed-signal family) | Yes | Yes | Yes | No (digital-only ProASIC3) |
| Unit Price (qty 1, as of 2026-09-02) | $340.02 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest -2 speed grade in the 600K Fusion 484-FBGA lineup (vs M7AFS600-1FG484I)
- Fusion mixed-signal capability vs digital-only ProASIC3 (vs M1AFS600-2FG484I)
- Nonvolatile flash with Live at Power-Up (vs M1AFS600-2FG484I and all SRAM FPGAs)
Design Notes
Design the power tree around a regulated 1.5V core rail plus separate I/O bank rails per the Fusion family datasheet. Estimated: core current scales with clock frequency and logic utilization - at 600K gates partially populated and tens of MHz fabric clocks, budget hundreds of milliamps on the core rail and verify with Microchip's power estimator tool in Libero SoC before finalizing the regulator. Use a regulator capable of handling inrush during flash wake-up, and follow the datasheet rail sequencing guidance to avoid latch-up between core and I/O domains during power cycling.
The 484-ball FBGA at 1.0 mm pitch typically requires at least a 6-layer board with via-in-pad or dog-bone fanout to escape 172 user I/Os plus power and ground balls. Follow the Fusion family PCB layout guidelines in the manufacturer datasheet: solid ground planes under the die, short return paths for banked I/O, and recommended ball-map decoupling (multiple 0.1 uF ceramics distributed around the package perimeter plus bulk capacitance at the regulator). Prioritize inner-layer routing for high-fanout signals and reserve outer layers for I/O escape.
The M7AFS600 is programmed only through the Microchip (Microsemi) Libero SoC toolchain with a FlashPro JTAG programmer - Xilinx Vivado, Intel Quartus, and Lattice tools cannot build for this family, so lock in tool licensing and programmer availability early in the project. Do not substitute Fusion parts across families (e.g., M1 ProASIC3 for M7 Fusion) without reviewing the mixed-signal block differences: the Fusion fabric includes analog peripherals that ProASIC3 lacks. Finally, re-run static timing analysis whenever the speed grade changes, even for pin-identical parts.
Compliance Information
Compliance status not stated in the provided web data. The GG suffix in sibling part numbers denotes Pb-free plating; verify RoHS/REACH status on the official Microchip product page before procurement.
