5CSEBA4U23I7LN - Cyclone V SE SoC FPGA 40K LE Dual A9 925MHz | Intel
MPN: 5CSEBA4U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $159.33 | $159.33 |
| 10 | $145.2 | $1,452.00 |
| 100 | $128.5 | $12,850.00 |
| 500 | $112.4 | $56,200.00 |
| 1,000 | $99.75 | $99,750.00 |
Drop-in alternatives for 5CSEBA4U23I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U23C8N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSEBA4U23C7N
✅ Drop-In✓ In Stock
$124.5 / Unit
View Datasheet →5CSEBA4U23C6N
✅ Drop-In✓ In Stock
$86.2 / Unit
View Datasheet →5CSEBA4U23A7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA6U23I7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEMA2U23C6N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA4U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Processor Clock Speed | 925 MHz |
| Package | 672-pin UBGA (23x23 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Process Technology | 28nm TSMC low-power |
| Transceivers | 3.125 Gbps (per Cyclone V family) |
| External Memory Interface | DDR3, DDR2, LPDDR2 (controller integrated in HPS + soft IP in FPGA fabric) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA4U23I7LN 672-pin ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA4U23I7LN (672-pin ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U23I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U23I7LN is suitable for 6 applications: Industrial Machine Vision Camera, Motor Drive and Servo Control, Broadcast Video Processing, Test and Measurement Instrumentation, Automotive Driver Assistance (ADAS), Industrial IoT Edge Gateway.
Industrial Machine Vision Camera
The 5CSEBA4U23I7LN is ideal for industrial machine vision cameras that interface with GigE Vision or CoaXPress image sensors. Its 40K Logic Elements can host hardware-accelerated image preprocessing pipelines (debayering, lens distortion correction, edge detection) in parallel while the dual ARM Cortex-A9 cores run OpenCV-based classification at up to 925 MHz. The shared coherent memory between FPGA and HPS eliminates copy overhead for frame buffers, reducing latency by 30-50% versus a discrete FPGA + external MCU architecture. Industrial -40C to +100C temperature grade supports IP67 enclosures on factory floors.
Recommended
Motor Drive and Servo Control
In AC servo drives and industrial motor controllers, the 5CSEBA4U23I7LN combines FPGA-based Field-Oriented Control (FOC) loops with ARM Cortex-A9 motion trajectory planning. The 224 18x18 multipliers in the Cyclone V SE fabric execute Park/Clarke transforms and PID loops with sub-microsecond latency, while the HPS runs EtherCAT or CANopen master stacks. Industrial temperature range supports operation inside motor cabinets at ambient up to +60C. The 672-pin UBGA exposes enough GPIO to interface with encoder feedback (EnDat, BISS, SSI) and 3-phase PWM outputs for multi-axis drives.
Recommended
Broadcast Video Processing
Broadcast studios use the 5CSEBA4U23I7LN for SDI video format conversion, frame-rate translation, and overlay graphics generation. The FPGA fabric handles SDI encode/decode at up to 3 Gbps (SMPTE 424M), while the ARM cores manage file I/O and network control. The 28nm low-power process keeps total system power under 10W in a 1U rackmount chassis. The 672-ball package provides sufficient GPIO for multi-channel SDI I/O and GPIO control surfaces. Industrial temperature rating suits broadcast truck and outdoor event production.
Recommended
Test and Measurement Instrumentation
Test equipment manufacturers leverage the 5CSEBA4U23I7LN to combine FPGA-based DSP signal processing with Linux-driven GUI and network control. Use cases include protocol analyzers, oscilloscope DSP pre-processors, and arbitrary waveform generators. The HPS runs a Yocto Linux rootfs hosting Qt-based UIs, while the FPGA implements the real-time DSP. Industrial -40C to +100C operation supports benchtop and portable instrument use cases. The 3.125 Gbps transceivers enable high-speed serial trigger and data links.
Recommended
Automotive Driver Assistance (ADAS)
For non-safety ADAS subsystems such as surround-view parking assist and driver monitoring, the 5CSEBA4U23I7LN integrates image preprocessing (fisheye correction, lens undistortion, object detection) with H.264 encoding and CAN bus networking. The dual ARM Cortex-A9 cores handle network stacks while the FPGA fabric accelerates vision algorithms. For full automotive -40C to +125C operation, the 5CSEBA4U23A7N variant is recommended. The 672-pin UBGA package supports multi-camera sensor aggregation.
Recommended
Industrial IoT Edge Gateway
The 5CSEBA4U23I7LN serves as an Industrial IoT edge gateway aggregating Modbus, PROFINET, and EtherCAT fieldbus data into MQTT/HTTPS cloud pipelines. The FPGA fabric implements deterministic fieldbus master cycles, while the ARM Cortex-A9 HPS runs containerized edge analytics and TLS-secured cloud uploads. Industrial temperature range supports DIN-rail mounted enclosures in unconditioned factory spaces. The 672-pin UBGA exposes sufficient GPIO for RS-485, RS-232, and GPIO-based legacy equipment interfaces.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23C8N | 5CSEBA4U23C7N | 5CSEBA4U23C6N | 5CSEBA4U23A7N | 5CSEBA6U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (23x23 mm) | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 110,000 |
| HPS Clock Speed | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) |
| Speed Grade | 7 (industrial) | 8 (commercial) | 7 (commercial) | 6 (commercial) | 7 (automotive) | 7 (industrial) |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Lead-Free / RoHS | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial -40C to +100C temperature grade (vs 5CSEBA4U23C8N)
- Higher logic density (40K LE) at industrial temp (vs 5CSEMA2U23C6N)
- Higher HPS clock speed (925 MHz) (vs 5CSEMA2U23C6N)
Design Notes
Estimated: at the maximum 925 MHz HPS clock and full FPGA utilization in 28nm TSMC process, total power consumption is approximately 5-8 W depending on toggle rate. The 672-pin UBGA package dissipates heat primarily through the die-side balls; designing a 4-layer PCB with a continuous ground plane under the BGA and 8 thermal vias in a 3x3 pattern per quadrant drops theta-JA from ~15 C/W (bare BGA) to ~6 C/W. At 8 W total dissipation, this yields a junction temperature rise of ~48 C above ambient - acceptable within the -40C to +100C industrial window but worth verifying against worst-case ambient.
Route DDR3 traces with matched-length matching within +/-25 mil and 100 ohm differential impedance for clocks per the Cyclone V External Memory Interface Handbook. Use a 1.0 mm pitch BGA fanout with 4/4 mil trace/space and microvia-in-pad construction for inner rows. Maintain a continuous reference plane beneath the BGA to provide impedance control; never route signals across a split in the reference plane under the package.
Use IBIS simulation for HPS DDR3 and LVDS interfaces before tape-out. Series damping resistors (22-33 ohm) on LVDS outputs reduce ringback on long backplane traces. For SDI/coaxial interfaces at 3 Gbps, follow AC-coupled 75 ohm design and isolate the connector ground with stitching vias at 1/10 wavelength spacing. The transceivers in this part support up to 3.125 Gbps per the Cyclone V Device Datasheet.
Do not confuse the U23 (672-pin UBGA) package with the U19 (484-pin UFBGA) package - they are NOT pin-compatible despite sharing the same silicon die. Always check the order code suffix (U19 vs U23) before PCB assembly. Boot configuration pins MSEL[3:0] must be pulled to the correct logic levels via 4.7k resistors to select FPP/x16/x32 configuration mode, otherwise the device will not configure from flash.
Compliance Information
RoHS compliant and lead-free per Intel product page. The I7LN variant is industrial-grade but NOT AEC-Q100 qualified - select the A7N variant for AEC-Q100 automotive applications. Halogen-free status not explicitly stated in the verified web data.
