Intel

5CSEBA6U23I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 672-UBGA | Intel

Name: 5CSEBA6U23I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 672-UBGA | Intel
Brand: Intel
SKU: 5CSEBA6U23I7NTS
Price: 213.52 USD
Availability: InStock

MPN: 5CSEBA6U23I7NTS ✓ Active

In Stock Ships in 1-3 business days

1.1 V Vdss 672-pin UBGA (23x23 mm) Package 925 MHz Speed 4,450,000 (4.45 Mbits) Memory

From $213.52 USD / Unit

MOQ: 1 |

Price updated: 2026-09-05

Volume Pricing

Qty	Unit Price	Extended
1	$333.63	$333.63
10	$300.27	$3,002.70
100	$266.9	$26,690.00
500	$240.21	$120,105.00
1,000	$213.52	$213,520.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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Drop-in alternatives for 5CSEBA6U23I7NTS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

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5CSEBA6U23I7NTS Maximum Ratings & Electrical Characteristics

Family	Cyclone V SE SoC FPGA
Logic Elements	110,000
Hard Processor System	Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency	925 MHz
Process Technology	28 nm low-power
Embedded Memory (Bits)	4,450,000 (4.45 Mbits)
DSP Blocks (18x18 Multipliers)	224
Package	672-pin UBGA (23x23 mm)
Core Voltage	1.1 V
Operating Temperature Grade	Industrial -40C to 100C
Mounting Type	Surface Mount
Packaging Format	Tray (NTS suffix)
DDR Memory Interface	DDR2/DDR3/LPDDR2 up to 3.125 Gbps
PCIe Hard IP	PCIe Gen2 x4
RoHS Status	Compliant

5CSEBA6U23I7NTS 672-pin ubga (23x23 mm) Pin Configuration Guide

Complete pinout information for 5CSEBA6U23I7NTS (672-pin ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-pin ubga (23x23 mm) package pinout diagram for 5CSEBA6U23I7NTS

No detailed pinout data available for 5CSEBA6U23I7NTS.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSEBA6U23I7NTS is suitable for 6 applications: Industrial Machine Vision Camera, Broadcast Video Processing, Factory Automation Controller, Medical Imaging Equipment, Automotive Driver Assistance ADAS, Software Defined Radio Platform.

🎥

Industrial Machine Vision Camera

The 5CSEBA6U23I7NTS is well-suited to industrial machine vision camera systems where its 110K logic elements implement hardware-accelerated image pipelines (sensor interface, debayering, gamma correction, defect pixel correction) while the dual ARM Cortex-A9 HPS at 925 MHz runs Linux for GigE Vision/USB3 Vision protocol stacks, image compression, and host API communication. Its 4.45 Mbits of embedded SRAM buffers multiple video frames between sensor input and output network transmission, while 224 DSP multipliers accelerate convolution and color-space conversion at pixel rate. The PCIe Gen2 hard IP and integrated Gigabit Ethernet MAC support 1 Gbps host uplink without additional PHY silicon.

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📺

Broadcast Video Processing

Broadcast video routers and format converters benefit from the 5CSEBA6U23I7NTS's combination of FPGA fabric running parallel SDI/HDMI processing paths and HPS running control software for EDID management and SNMP monitoring. The 672-UBGA U23 package exposes sufficient I/O for multi-channel 3G-SDI input/output alongside HDMI 2.0 TX/RX interfaces implemented in FPGA logic. Industrial temperature grade -40C to +100C enables chassis-mounting in outdoor broadcast enclosures without derating, and Intel Cyclone V SoC is on the broadcast industry's AVB/TSN reference designs for SDI-over-IP transitions.

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5CSEBA5U23I7N · Intel 10M50SAE144C8G · Intel

🏭

Factory Automation Controller

The 5CSEBA6U23I7NTS integrates the deterministic real-time response of FPGA logic with the high-level network connectivity required for Industry 4.0 controllers. The HPS runs a real-time Linux or VxWorks instance handling PROFINET, EtherCAT, or EtherNet/IP master stacks over the integrated Gigabit Ethernet MAC, while the 110K logic elements implement high-speed EtherType frame inspection, deterministic sub-millisecond control loops, and encoder interface logic. The device's PCIe Gen2 endpoint supports host backplane cards in modular PLC racks.

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5CSEBA5U23I7N · Intel 10M25DAF484C7G · Intel

💊

Medical Imaging Equipment

Diagnostic ultrasound carts and portable X-ray systems leverage the 5CSEBA6U23I7NTS where 110K logic elements implement front-end beamforming, channel summing, and image reconstruction in FPGA fabric, while the dual ARM Cortex-A9 HPS hosts the Linux-based user interface, DICOM image stack, and network connectivity to hospital PACS systems. The industrial temperature grade suits continuous operation in clinical environments, and the SoC's hardware FPU accelerates beamforming arithmetic in conjunction with 224 DSP multipliers for real-time image formation.

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5CSEBA4U23I7N · Intel AD9680BCPZ-500 · Analog Devices

🚗

Automotive Driver Assistance ADAS

The Cyclone V SE SoC platform used by the 5CSEBA6U23I7NTS family has reference designs for surround-view and front-camera ADAS ECUs where FPGA logic runs multi-camera sensor fusion at 30 fps, while the HPS handles CAN-FD communication, vehicle bus diagnostics (UDS), and AUTOSAR application software. Although the standard -I7 industrial grade is used for non-safety subsystems, designs targeting ASIL-rated functions can pair the SoC with an external safety MCU like a TI TDA3x for redundancy.

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5CSEBA5U23I7N · Intel 10M16DAF484I7G · Intel

📡

Software Defined Radio Platform

Software defined radio (SDR) baseband cards employ the 5CSEBA6U23I7NTS where its 110K logic elements implement DDC/DUC, channelizers, and modulation/demodulation at baseband, while the integrated Cortex-A9 runs GNU Radio or custom DSP frameworks at higher layers of the protocol stack. The transceiver interface supports up to 6.144 Gbps serial links to RF front-end ADCs/DACs like the AD9680, and the integrated 3.125 Gbps DDR3 controller buffers large FFT windows with low latency for real-time spectral analysis in electronic warfare and 5G base-station research platforms.

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5CGXBC9D7F27C8N · Intel AD9680BCPZRL7-1000 · Analog Devices

Recommended Products Summary

5CGXBC7B7M15C8N Intel Used in: Industrial Machine Vision Camera 10M16SAU169C8G Intel Used in: Industrial Machine Vision Camera ADAR1000ACCZN Analog Devices Used in: Industrial Machine Vision Camera 5CSEBA5U23I7N Intel Used in: Broadcast Video Processing, Factory Automation Controller, Automotive Driver Assistance ADAS 10M50SAE144C8G Intel Used in: Broadcast Video Processing 10M25DAF484C7G Intel Used in: Factory Automation Controller 5CSEBA4U23I7N Intel Used in: Medical Imaging Equipment AD9680BCPZ-500 Analog Devices Used in: Medical Imaging Equipment 10M16DAF484I7G Intel Used in: Automotive Driver Assistance ADAS 5CGXBC9D7F27C8N Intel Used in: Software Defined Radio Platform AD9680BCPZRL7-1000 Analog Devices Used in: Software Defined Radio Platform

What is the 5CSEBA6U23I7NTS and what processor does it integrate?

The 5CSEBA6U23I7NTS is a Cyclone V SE family System-on-Chip (SoC) FPGA from Intel (formerly Altera) that integrates a dual-core ARM Cortex-A9 MPCore hard processor system (HPS) with 110K logic elements of 28nm FPGA fabric, housed in a 672-UBGA (23x23 mm) package. According to Intel Cyclone V SoC datasheet documentation, the HPS runs up to 925 MHz with NEON SIMD, hardware FPU, and 32KB/32KB L1 plus 512KB shared L2 caches.

How many logic elements and DSP blocks does 5CSEBA6U23I7NTS provide?

The 5CSEBA6U23I7NTS delivers 110,000 logic elements of FPGA fabric plus 4.45 Mbits of embedded SRAM and 224 18x18 multipliers for DSP acceleration. This resource budget suits image pipelines, motor control loops, and protocol bridging applications where parallel hardware processing is required alongside an OS-capable processor.

What is the operating temperature range of 5CSEBA6U23I7NTS?

The 5CSEBA6U23I7NTS is rated for industrial temperature operation from -40C to +100C junction, per the ordering code suffix -I7. This makes it suitable for factory automation, outdoor broadcast equipment, and automotive non-safety applications where commercial-grade parts would not survive thermal stress.

Where can I buy the 5CSEBA6U23I7NTS and what is the unit price?

The 5CSEBA6U23I7NTS is available at authorized distributors including DigiKey (manufacturer part number 8259256), Mouser, LCSC (C1550362), Octopart, and Heisener. As of 2026-09-06, LCSC lists pricing at $333.63 per unit (qty 1), with volume discounts reducing the unit price to approximately $213.52 at qty 1000. Heisener currently shows 6,928 pieces in stock with lead times of approximately one week.

What is the lead time for 5CSEBA6U23I7NTS?

As of 2026-09-06, Heisener quotes 6,928 pieces in stock with estimated delivery of April 11-16 for expedited shipping. LCSC and DigiKey listings indicate ships-today availability when stock is present. For volume orders beyond current distributor stock, lead times typically extend to 8-12 weeks when ordering from Intel directly.

Is 5CSEBA6U23I7NTS in stock at major distributors?

Yes, as of 2026-09-06 the 5CSEBA6U23I7NTS shows available stock at Heisener (6,928 pieces) and ships-today listings on DigiKey and Mouser. The Cyclone V SE family remains in active production status. LCSC also lists inventory under part number C1550362 with on-line ordering enabled.

5CSEBA6U23I7NTS vs 5CSEBA5U23I7N - which has more logic resources?

The 5CSEBA6U23I7NTS (A6) and 5CSEBA5U23I7N (A5) share the same SE SoC family and dual ARM Cortex-A9 architecture, but differ in logic element count: A6 provides 110K LE while A5 provides 85K LE, a difference of approximately 29%. For designs that exceed 85K logic utilization, 5CSEBA6U23I7NTS is the correct choice; for smaller logic budgets the A5 variant offers a cost-effective drop-in alternative with the same 672-UBGA U23 package.

What is the difference between 5CSEBA6U23I7NTS and 5CSEBA6U19I7N?

The 5CSEBA6U23I7NTS and 5CSEBA6U19I7N both belong to the Cyclone V SE SoC family with 110K logic elements and dual ARM Cortex-A9 cores, but they differ in package: the U23 variant uses a 672-UBGA 23x23 mm body, while the U19 variant uses a smaller 484-UBGA 19x19 mm body with reduced pin count. Choose U23 when maximum I/O and full transceiver count are required; choose U19 for compact PCB layouts.

When should I choose 5CSEBA6U23I7NTS over a pure FPGA like 5CGXBC9C7F23C8N?

Choose 5CSEBA6U23I7NTS when your design requires an integrated OS-capable processor running Linux or RTOS alongside FPGA-accelerated logic - the SoC eliminates external processor-to-FPGA bridge latency and reduces PCB area. Choose a standalone Cyclone V GX like 5CGXBC9C7F23C8N when all processing can be implemented in FPGA logic or when an external processor already exists on the board. For pure logic-only designs without an HPS, the GX family offers lower cost per logic element.

What is the best drop-in replacement for 5CSEBA6U23I7NTS in the same 672-UBGA package?

The best drop-in replacement for the 5CSEBA6U23I7NTS within the same Cyclone V SE family and 672-UBGA U23 footprint is the 5CSEBA6U23I7N (without the NTS suffix), which shares identical silicon and pinout but ships in tape-and-reel format instead of tray. For designs that can tolerate lower logic capacity, the 5CSEBA5U23I7N is a same-package drop-in alternative with 85K logic elements instead of 110K. The 5CSEBA6U23I7LN is a lower-speed grade variant with the same die.

Where can I download the 5CSEBA6U23I7NTS datasheet PDF?

The official Cyclone V SE datasheet is available on the Intel Altera product page at https://www.altera.com/products/fpga/cyclone/v/se/5csea6-u23/5CSEBA6U23I7NTS. The complete Cyclone V device handbook covering pinout, package, electrical characteristics, and timing is bundled with Intel Quartus Prime design software and also published at intel.com content library under Cyclone V device documentation.

Where can I find the 5CSEBA6U23I7NTS pinout and BGA ball map?

The 5CSEBA6U23I7NTS uses the 672-UBGA U23 package. Pin assignments are documented in the Cyclone V device handbook pin-out files for the U23 672-pin package, downloadable from the Intel FPGA documentation library alongside Quartus Prime software. The pinout PDF lists HPS GPIO banks, FPGA I/O banks, transceiver pins, DDR interfaces, and PCIe lane assignments in ball-grid coordinates matching the 23x23 mm substrate.

What are the power supply requirements for 5CSEBA6U23I7NTS?

The 5CSEBA6U23I7NTS requires multiple supply rails: 1.1V core (VCC, VCC_HPS), 1.8V/2.5V/3.3V programmable I/O banks (VCCIO), 2.5V/3.3V analog and HPS peripheral (VCCPD, VCCP_HPS), 1.8V transceiver supply (VCC_GXB), and a 1.8V/3.3V battery backup domain. Per Cyclone V Power Management User Guide, power-on sequence requires core rail first then I/O rails with monotonic rise to avoid latch-up; proper decoupling of 100nF plus 10uF per supply pin is mandatory.

What operating systems does the HPS in 5CSEBA6U23I7NTS support?

The dual ARM Cortex-A9 HPS in 5CSEBA6U23I7NTS supports Linux (mainline kernel via SoCFPGA platform with mainline U-Boot), VxWorks, FreeRTOS, and other RTOS distributions validated through the Intel SoC EDS (Embedded Development Suite). Intel provides the Golden System Reference Design (GSRD) which boots Linux from SD card with Ethernet and USB host active out of reset, and Altera/Intel maintains a Linux BSP for board manufacturers.

How does 5CSEBA6U23I7NTS compare with Xilinx Zynq-7000 SoC FPGAs?

The 5CSEBA6U23I7NTS Cyclone V SE with dual ARM Cortex-A9 at 925 MHz is broadly comparable to Xilinx Zynq-7015/7030 in architecture: both integrate dual Cortex-A9 with FPGA fabric, both support DDR3 memory controllers, both expose PCIe Gen2 hard IP. Differences include Cyclone V SE's lower 110K LE count versus Zynq-7030's 125K, and toolchain (Quartus Prime vs Vivado). For designs with cross-platform portability requirements, both ecosystems offer Linux mainline support.

Engineering reference data for 5CSEBA6U23I7NTS — comparison, design guidance, and compliance information.

Selection Guide

Choose the 5CSEBA6U23I7NTS when your design requires maximum logic density (110K LE) in the Cyclone V SE SoC family, in a 672-UBGA U23 footprint, with industrial temperature grade for extended thermal operation. The NTS tray packaging suits prototype and low-volume production. Select 5CSEBA6U23I7N instead when ramping to high-volume SMT assembly. For designs with logic utilization below 85K LE, the 5CSEBA5U23I7N or 5CSEBA4U23I7N provide cost-effective drop-in alternatives sharing the same 672-UBGA U23 package. Choose the lower-speed 5CSEBA6U23I7LN when reducing dynamic power outweighs the need for higher FPGA fabric clock rates. For designs that do not require an integrated ARM Cortex-A9 HPS, consider the standalone Cyclone V GX family (5CGXBC) for lower per-unit cost. Cross-brand equivalents from Xilinx Zynq-7000 or Microchip PolarFire SoC require PCB redesign due to differing package pinouts, so they are not drop-in alternatives.

Comparison with Alternatives

Parameter	This Product	5CSEBA6U23I7N	5CSEBA6U23I7LN	5CSEBA5U23I7N	5CSEBA4U23I7N	5CSEBA2U23I7N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	672-UBGA (U23, 23x23 mm)	672-UBGA (U23, 23x23 mm) - same	672-UBGA (U23, 23x23 mm) - same	672-UBGA (U23, 23x23 mm) - same	672-UBGA (U23, 23x23 mm) - same	672-UBGA (U23, 23x23 mm) - same
Family	Cyclone V SE SoC	Cyclone V SE SoC	Cyclone V SE SoC	Cyclone V SE SoC	Cyclone V SE SoC	Cyclone V SE SoC
Logic Elements	110,000	110,000	110,000	85,000	49,000	25,000
HPS Maximum Frequency	925 MHz	925 MHz	[DATA_NEEDED]	925 MHz	925 MHz	925 MHz
Embedded Memory	4.45 Mbits	4.45 Mbits	4.45 Mbits	4.15 Mbits	2.85 Mbits	1.55 Mbits
DSP Blocks (18x18)	224	224	224	174	132	66
Speed Grade	I7 (industrial)	I7 (industrial)	L7 (low-power)	I7 (industrial)	I7 (industrial)	I7 (industrial)
Packaging Format	Tray (NTS)	Tape & Reel (N)	Tray (N)	Tape & Reel (N)	Tape & Reel (N)	Tape & Reel (N)

Key Differentiators

Highest logic element count in SE SoC family with same 672-UBGA U23 footprint (vs 5CSEBA5U23I7N)
Tray packaging for low-volume prototyping (vs 5CSEBA6U23I7N)
Industrial speed grade for extended temperature operation (vs 5CSEBA6U23I7LN)

Design Notes

Estimated: With typical FPGA utilization of 70% at 925 MHz HPS clock and 100 MHz fabric clock, the 5CSEBA6U23I7NTS consumes approximately 6-9 W. The Cyclone V PowerPlay Early Power Estimator must be run with actual design utilization to confirm. Multiple regulated rails are required: 1.1V core, 1.8V/2.5V/3.3V VCCIO banks, 2.5V/3.3V VCCPD, 1.8V VCC_GXB for transceivers, plus HPS-specific 1.1V VCC_HPS, 1.8V/2.5V/3.3V VCCIO_HPS, and a separate 1.8V/3.3V VBAT backup domain. Power-on sequencing per Cyclone V handbook requires core rail first, then I/O rails, with monotonic rise to prevent latch-up. Use at least 100nF X7R ceramic decoupling per power pin plus bulk 10-22uF per rail.

The 672-UBGA U23 package requires a 23x23 mm substrate with 0.8 mm ball pitch. PCB stackup must use at minimum a 6-layer design with dedicated ground and power planes; high-speed transceiver lanes require 100-ohm differential impedance control with length matching within 0.13 mm. All BGA balls require microvia-in-pad construction with 0.4 mm laser-drilled vias. Solder mask-defined (SMD) pads are preferred over non-solder mask defined (NSMD) for BGA reliability under thermal cycling, per IPC-7095 class 3 requirements.

Estimated: At full HPS plus 70% FPGA utilization the 5CSEBA6U23I7NTS dissipates 6-9 W into the 672-UBGA. Without forced airflow, a thermal pad bonded to a 50x50 mm copper pour on the top side plus an 80x80 mm copper pour on the bottom side is required to keep junction temperature below 100C for industrial temperature grade. For sealed enclosures above 50C ambient, a small 20 mm heatsink with thermal interface material is recommended. Reference: Cyclone V Device Handbook, Thermal Management chapter.

DDR3 interfaces to the HPS must follow the Cyclone V External Memory Interface Handbook pinout guidelines: 50-ohm controlled impedance with 2 mm trace spacing, fly-by topology for command/address/clock, differential clock length matched within 0.5 ps of strobes. PCIe Gen2 x4 lanes require AC-coupled differential pairs with 85-100-ohm differential impedance and length matching within 0.13 mm. LVDS FPGA I/O should use 100-ohm differential terminator close to the receiver end.

Common pitfalls: (1) Configuring MSEL pins incorrectly at board power-up will cause the FPGA to fail to enter user mode - verify MSEL[4:0] match the configuration scheme (AS, JTAG, FPP) before power application. (2) Confusing Cyclone V SE (with transceivers) with Cyclone V SX (without transceivers) - the SE family supports up to 6 transceiver channels but they require 1.8V VCC_GXB that must be present even if unused. (3) Confusing U23 (672-pin) with U19 (484-pin) packages - they have different pinout and are NOT pin-compatible despite similar product names.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

RoHS compliant per Cyclone V SE product family material declaration. AEC-Q100 qualified variants are available in the Cyclone V automotive-grade product line with separate order codes - the standard 5CSEBA6U23I7NTS is industrial grade and not AEC-Q100 qualified. Halogen-free status not specified in available data.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Manufacturer_Product_Page, Distributor, Octopart, Distributor, Distributor

Related Components & Terms

Intel Altera 5CSEBA6U23I7NTS 5CSEBA6U23I7N 5CSEBA5U23I7N 5CSEBA4U23I7N Cyclone V Cyclone V SE System on Chip (SoC) FPGA ARM Cortex-A9 MPCore CoreSight Hard Processor System (HPS) NEON SIMD Logic Element DSP block 672-UBGA RoHS AEC-Q100 machine vision industrial automation software defined radio DDR3 PCIe Gen2