A3P600-1FG484 - ProASIC3 600K-Gate Flash FPGA 484-FBGA | Microchip
MPN: A3P600-1FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.9 | $389.00 |
| 100 | $34.2 | $3,420.00 |
| 500 | $30.8 | $15,400.00 |
| 1,000 | $27.5 | $27,500.00 |
Drop-in alternatives for A3P600-1FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-FG484
✅ Drop-In✓ In Stock
$56.3 / Unit
View Datasheet →A3P600-2FG484
✅ Drop-In✓ In Stock
$61.5 / Unit
View Datasheet →A3P600-1FGG484
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →A3P600-1FG484I
✅ Drop-In✓ In Stock
$30.85 / Unit
View Datasheet →A3P600L-1FG484
✅ Drop-In✓ In Stock
$58.9 / Unit
View Datasheet →A3P600-1FG484 Maximum Ratings & Electrical Characteristics
| System Gates | 600000 gates |
| Distributor Listing Resource Count | 110592 (per DigiKey listing) |
| User I/O | 235 |
| Embedded Memory | 13.5 kbit SRAM |
| System Performance | 272 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Logic Family | CMOS |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Package Type | 484-ball FBGA, 1 mm ball pitch |
| Operating Temperature | 0 to 70 C |
| Mounting Type | Surface Mount |
| Speed Grade | -1 |
| Reprogrammability | Yes (JTAG reprogrammable) |
A3P600-1FG484 484-ball fbga, 1 mm ball pitch Pin Configuration Guide
Complete pinout information for A3P600-1FG484 (484-ball fbga, 1 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-1FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FG484 is suitable for 6 applications: Industrial Automation Controllers, Medical Instrumentation, Communications Line Cards, Aerospace and Defense Pre-Development, Test and Measurement Equipment, Battery-Powered and Low-Power Systems.
Industrial Automation Controllers
The A3P600-1FG484 fits industrial controller designs where 600K gates cover motor sequencing, state machines, and multi-protocol bridging while 235 user I/Os connect drives, sensors, and HMI backplanes across independently banked VCCIO domains. Because configuration resides in on-chip flash, the FPGA is operational within microseconds of power-up, meeting deterministic startup requirements in PLC and motion-control cabinets - no external configuration PROM boot delay. Placed as the glue-logic and interface layer between a host MCU and I/O modules, the fabric sustains the family's 272 MHz-class performance at the -1 speed grade. The trade-off versus an SRAM FPGA is lower peak fabric speed and soft-IP ecosystem depth, but the single-chip BOM and instant-on behavior typically win in industrial ground-safe environments. For enclosures exceeding 70 C, select the industrial-temperature A3P600-1FG484I drop-in variant.
Recommended
Medical Instrumentation
Medical diagnostic and imaging equipment benefits from the A3P600-1FG484's flash-based configuration security: on-chip flash cells resist configuration readback, protecting proprietary signal-processing IP in patient-connected hardware. The 600K-gate fabric implements acquisition sequencing, filter chains, and interface glue logic between analog front ends and host processors, while 13.5 kbit of true dual-port SRAM buffers inter-domain data streams. The 484-FBGA footprint's 235 I/Os accommodate multi-board ribbon interconnects typical of benchtop instrumentation. Because the device is single-chip and instant-on, calibration routines stored in fabric start immediately after power-good - simplifying self-test sequences required by medical device procedures. Its 1.5V core supports low thermal footprint inside sealed enclosures, though designers should budget I/O bank voltages early to avoid respins during regulatory design freezes.
Recommended
Communications Line Cards
In telecom and networking line cards, the A3P600-1FG484 acts as a protocol bridge and backplane-interface controller. Its 235 user I/Os in the 484-ball FBGA provide dense pin-out for LVDS-class and single-ended interconnects to PHY devices and backplane connectors, while the 272 MHz-class fabric at the -1 grade handles framing, deskew, and status aggregation logic. The 13.5 kbit embedded true dual-port SRAM supports clock-domain crossing FIFOs with independent read/write ports. Flash configuration means line cards power up and declare ready to the chassis manager without waiting for a bitstream load over a configuration bus - reducing system bring-up time in redundant-architecture shelves. Designers should reserve JTAG access for field reprogramming, enabling firmware-updatable behavior across the installed base without solder rework.
Recommended
Aerospace and Defense Pre-Development
The ProASIC3 family is the commercial predecessor to Microchip's RTAX radiation-tolerant FPGA lines, making the A3P600-1FG484 a natural prototyping vehicle for defense and space programs that later migrate to RTAX-series devices. Engineers can validate RTL, test benches, and board-level interfaces on commercial ProASIC3 silicon in the same flash-based architecture before committing to radiation-hardened parts such as the RTAX2000S or RTAX4000S families. The instant-on flash fabric also serves ground-support equipment and non-rad launch infrastructure, where secure single-chip configuration and 0-70 C commercial ratings are sufficient. Using the same Libero SoC toolchain across ProASIC3 and RTAX reduces re-learning cost and lets IP blocks port with minimal modification between the prototype and flight device.
Recommended
Test and Measurement Equipment
Bench instruments and automated test equipment (ATE) use the A3P600-1FG484 as timing controllers, pattern generators, and fixture-interface logic. The 600K-gate fabric implements stimulus engines and response comparators, while 235 I/Os address the dense pin counts of pogo-pin and socket fixtures in the 484-FBGA footprint. The 13.5 kbit dual-port SRAM provides capture buffers between the device-under-test domain and the measurement backplane. Flash-based instant-on configuration allows the instrument to pass power-on self-test quickly, and JTAG reprogrammability lets manufacturers ship one hardware platform updated with instrument-specific configurations per SKU - reducing the PCB variants maintained across a product line. The commercial 0-70 C rating fits typical laboratory environments.
Recommended
Battery-Powered and Low-Power Systems
The A3P600-1FG484's 1.5V core and flash-based fabric support power-sensitive designs, and where the budget tightens further the pin-compatible A3P600L-1FG484 low-power variant drops onto the same 484-FBGA footprint with reduced static power. Flash FPGAs avoid SRAM-cell leakage associated with configuration storage and eliminate the standby draw of an external configuration device. In portable and remote instruments, instant-on behavior enables aggressive power gating: the FPGA is usable immediately at wake rather than after a multi-hundred-millisecond bitstream load, letting system firmware keep rails off longer. With 235 I/Os, one device can replace several smaller glue-logic ICs, cutting total system quiescent current and board area in battery-operated data loggers and field instruments.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FG484 | A3P600-2FG484 | A3P600-1FGG484 | A3P600-1FG484I | A3P600L-1FG484 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA, 1 mm pitch | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -1 | Standard | -2 (faster) | -1 | -1 | -1 |
| User I/O | 235 | 235 | 235 | 235 | 235 | 235 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to 70 C | 0 to 70 C | 0 to 70 C | 0 to 70 C | Industrial range (wider) | 0 to 70 C |
| Configuration Memory | On-chip flash, single-chip | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Instant-on single-chip configuration (vs A3PE600-1FG484 (ProASIC3E))
- Fastest timing margin in same footprint (vs A3P600-1FG484 vs A3P600-2FG484)
- Industrial temperature drop-in availability (vs A3P600-1FG484I)
- Lower static power option (vs A3P600L-1FG484)
Design Notes
The 484-ball FBGA with 1 mm ball pitch requires a controlled-expansion PCB stackup; use a minimum 6-layer board with dedicated VCCIO bank planes. Fan out with via-in-pad or dog-bone escape on outer two rows, and plan escape channels before routing so inner balls (up to row 11) remain reachable. Verify ball map directly against the 'Package Pin Assignments' chapter of the Microchip ProASIC3 datasheet rather than reusing footprints from other FPGA families, since bank boundaries differ between families.
The device runs a 1.5V core with separate VCCIO banks supporting multiple I/O standards. Group I/O assignments by voltage standard early in pin planning in Libero SoC, because bank voltage cannot be changed after layout. Estimated: core current depends on design activity, so run Microchip's SmartPower power estimator with your actual RTL utilization before selecting regulators; do not size supplies from the family datasheet typicals alone.
Speed grade changes (e.g., replacing A3P600-1FG484 with A3P600-FG484 standard grade) are electrically drop-in but NOT timing drop-in: static timing must be re-verified and the design recompiled for the substituted grade. Additionally, the commercial part is rated 0 to 70 C - selecting the A3P600-1FG484I industrial variant is required for enclosures outside that range. Confirm the I-temp grade's temperature limits in the Microchip ordering-information tables before qualification.
Reserve JTAG access on a header even after production. The ProASIC3 flash fabric is field-reprogrammable, and keeping the TMS/TCK/TDI/TDO chain exposed lets you update the configuration without reworking the board. Place 0.1 uF decoupling capacitors at each VCC/VCCIO ball pair as close to the package as possible, per standard Microchip ProASIC3 layout guidance in the family datasheet.
Compliance Information
Compliance details were not stated in the provided verified web data; Microchip product pages carry RoHS/REACH declarations per MPN suffix. The FGG-suffixed variants (e.g., A3P600-1FGG484) are the lead-free designated options in this family.
