Microchip Technology

A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip

MPN: A3PE3000L-FG896M ✓ Active
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1.2 V / 1.5 V Vdss 896-ball FBGA (FG896) Package On-chip flash (nonvolatile, single-chip) Memory
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Price updated: 2026-09-02
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A3PE3000L-FG896M Overview

The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.

A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.

Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.

Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.

Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.

Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for A3PE3000L-FG896M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with A3PE3000L-FG896M (same form factor and footprint) — differing in Family, Package, Configuration Memory, Process Technology, RoHS Status.

Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
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Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
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Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
Compare with A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
Compare with A3PE3000L-FG896M →

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A3PE3000L-FG896M Maximum Ratings & Electrical Characteristics

Family ProASIC3L (ProASIC3EL)
Equivalent Gates 3,000,000
Logic Cells 75,264
User I/O 620
Process Technology 130 nm CMOS flash
Core Voltage 1.2 V / 1.5 V
Package 896-ball FBGA (FG896)
Mounting Type Surface Mount
Configuration Memory On-chip flash (nonvolatile, single-chip)
Low-Power Technology Flash*Freeze
JTAG Boundary Scan IEEE 1149.1
Input Type Option Schmitt trigger on single-ended inputs
Pull Resistors Weak pull-up / pull-down
Temperature Grade M (military screening per suffix)

A3PE3000L-FG896M 896-ball fbga (fg896) Pin Configuration Guide

Pin configuration for A3PE3000L-FG896M (896-ball fbga (fg896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

896-ball fbga (fg896) package pinout diagram for A3PE3000L-FG896M

No detailed pinout data available for A3PE3000L-FG896M.

Refer to the datasheet for full pin configuration.

Typical Applications

A3PE3000L-FG896M is suitable for 3 applications: Embedded Systems, IoT Devices, Industrial Control.

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Embedded Systems

Core processing in embedded applications using A3PE3000L-FG896M.

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IoT Devices

Smart connected devices powered by A3PE3000L-FG896M.

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Industrial Control

Automation and control systems using A3PE3000L-FG896M.

No FAQ available for this product.

Engineering reference data for A3PE3000L-FG896M — comparison, design guidance, and compliance information.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in the provided web data.

Data verified on: 2026-09-02 — data verified and curated by XAIPART's component engineering team

Related Components & Terms

Microchip Technology Actel Corporation Microsemi Corporation A3PE3000L-FG896M ProASIC3L flash FPGA field-programmable gate array Flash*Freeze technology 896-ball FBGA IEEE 1149.1 JTAG 130nm CMOS SRAM FPGA low-power FPGA military FPGA boundary scan
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