A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
MPN: A3PE3000-FG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $189.5 | $189.50 |
| 10 | $176.2 | $1,762.00 |
| 100 | $158.4 | $15,840.00 |
| 500 | $142.1 | $71,050.00 |
| 1,000 | $129.8 | $129,800.00 |
Drop-in alternatives for A3PE3000-FG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-FGG896
✅ Drop-In✓ In Stock
$340 / Unit
View Datasheet →A3PE3000-FG896I
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$195 / Unit
View Datasheet →A3PE3000-FGG896I
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$135.2 / Unit
View Datasheet →A3PE3000L-FG896M
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View Datasheet →A3PE3000L-FGG896M
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View Datasheet →A3PE3000L-FGG896I
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$139.9 / Unit
View Datasheet →A3PE3000L-FG896I
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View Datasheet →A3PE3000-FG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 3000000 |
| Number of I/O | 620 |
| Embedded Memory | 516096 bit |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (non-volatile, reprogrammable) |
| Package | 896-BGA (FBGA) |
| Mounting Style | SMD/SMT |
| Operating Temperature | 0 C to +70 C |
| Packaging | Tray |
| Speed Grade | Standard (-) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch |
| Global Networks | VersaNet low-skew high-fanout networks |
| RoHS Status | Non-green package (FG prefix; FGG variants are RoHS green) |
A3PE3000-FG896 896-bga (fbga) Pin Configuration Guide
Complete pinout information for A3PE3000-FG896 (896-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-FG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-FG896 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Medical Instrumentation, Test and Measurement Equipment, Aerospace and Defense Subsystems, Embedded System Prototyping and ASIC Emulation.
Industrial Automation and Control
The A3PE3000-FG896 fits industrial automation controllers where its 3M system gates absorb protocol bridging, motion-profile logic, and safety interlocks, while 620 user I/Os interface PLC backplanes, encoders, and field sensors. Its flash configuration gives instant-on logic at power-up, so the controller does not wait for an external boot ROM, an advantage over SRAM FPGAs in factory-floor nodes subject to frequent power cycling. Embedded memory of 516096 bits implements FIFOs between heterogeneous bus domains. For factory environments with wide ambient swings, select the A3PE3000-FG896I industrial variant instead; the commercial-grade FG896 is best for environmentally controlled cabinets. Instant-on behavior also simplifies determinism analysis for cycle-time-critical I/O scanning loops.
Recommended
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-FG896's combination of 231 MHz system performance and 620 I/Os for parallel PHY interfaces, backplane buses, and framing logic. The VersaNet low-skew global networks distribute line-rate clocks across the die with minimal skew, per the ProASIC3E fabric user guide, which matters for source-synchronous parallel data capture. The 516096-bit embedded SRAM buffers packet streams between MAC and switch-core domains. Because configuration is flash-based, cards are live within milliseconds of slot insertion, supporting hot-swap and fast-failover requirements. For thermally dense chassis, the same footprint accepts the low-power A3PE3000L-FG896M drop-in, cutting static dissipation without a PCB respin.
Recommended
Medical Instrumentation
Diagnostic and laboratory medical instruments use the A3PE3000-FG896 to glue together analog front ends, data converters, and host interfaces. Its instant-on flash fabric means acquisition subsystems are ready as soon as power is applied, shortening instrument boot time for point-of-care devices. The 620 user I/Os drive high-channel-count front ends, while the 3M-gate capacity implements channel-sequencing state machines, digital filtering, and communication stacks simultaneously. Commercial 0 C to +70 C rating suits clinical environments; portable or outdoor telemetry designs should use the industrial A3PE3000-FG896I variant on the same PCB. Embedded FIFO memory between ADC banks and processing blocks avoids external SRAM, reducing BOM count and board area in compact enclosures.
Recommended
Test and Measurement Equipment
Bench and automated test instruments leverage the A3PE3000-FG896 for pattern generation, timing capture, and bus emulation, exploiting 620 I/Os to drive many channels in parallel from a single device. The 231 MHz fabric timing supports source-synchronous capture of mid-speed parallel buses, while VersaTiles configured as D flip-flops with enable build per-channel timing verniers. Flash configuration removes the configuration-ROM bring-up delay at each instrument power cycle, and the non-volatile fabric retains its image through brownouts common on lab benches. The 516096-bit embedded memory implements deep capture FIFOs. Design teams targeting extended-temperature testers should drop in the pin-compatible A3PE3000-FG896I without changing the PCB footprint.
Recommended
Aerospace and Defense Subsystems
Flash FPGAs are attractive in avionics and defense electronics because the non-volatile configuration is inherently instant-on and single-chip, and the A3PE3000-FG896 provides 3M gates of mission logic with 620 I/Os for sensor and actuator interfaces. ProASIC3E architecture is deployed in space and defense programs where SRAM configuration-readout concerns push designers toward flash fabric, per Microchip positioning of the family. Ground-based radar, test benches, and manned-platform subsystems within 0 C to +70 C can use this commercial grade; temperature-extended builds should select the A3PE3000L-FG896M drop-in, which keeps the identical 896-ball FBGA footprint while adding extended temperature and reduced static power for convection-cooled enclosures.
Recommended
Embedded System Prototyping and ASIC Emulation
R&D teams use the A3PE3000-FG896 as a reprogrammable prototyping vehicle: 3M gates accommodate substantial RTL blocks, and 620 I/Os expose wide buses to logic analyzers and FPGA-to-FPGA bridges. Unlike antifuse one-time-programmable devices, the flash fabric is fully reprogrammable in-system, so iterative RTL debugging does not consume new silicon, lowering total cost of ownership per Microchip family positioning. The 516096-bit embedded memory models on-chip RAM or FIFO structures during emulation. Because the same footprint hosts the industrial FG896I and low-power A3PE3000L variants, a validated prototype PCB migrates directly to production builds, including extended-temperature derivatives, without layout revision, protecting schedule when qualification variants are needed.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-FG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FG896I | A3PE3000-FGG896 | A3PE3000L-FG896M |
|---|---|---|---|---|
| Brand | Microchip Technology (Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 896-BGA (FBGA) | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Operating Temperature | 0 C to +70 C (commercial) | Industrial (-40 C range) | 0 C to +70 C (commercial) | Extended (M suffix) |
| RoHS / Green Package | No (FG standard package) | No (FG standard package) | Yes (G = green) | No (FG standard package) |
| Core Power Characteristic | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Low-power A3PE3000L family |
| Configuration | Flash, non-volatile, reprogrammable | Flash, non-volatile | Flash, non-volatile | Flash, non-volatile |
Key Differentiators
- Single-chip instant-on flash configuration (vs SRAM FPGAs (e.g., Spartan-3 class))
- Footprint-identical extended-temperature variants (vs A3PE3000-FG896I)
- Low-power family option on same footprint (vs A3PE3000L-FG896M)
Design Notes
Estimated: budget the 1.5 V core rail first using Libero SmartPower estimates for your utilization, since flash FPGAs dissipate static power proportional to configured fabric. Bank I/O supplies (VCCI) must match the selected I/O standards per bank; when using voltage-referenced standards, the ProASIC3E datasheet requires one VREF pin assignment per minibank. Decouple each VCCI bank with local ceramics close to the ball via fanout to limit di/dt droop during simultaneous switching on wide parallel buses.
The 896-ball FBGA requires a via-in-pad or dog-bone fanout strategy; verify ball pitch against your fabricator's capability before layout release. Follow the ProASIC3E datasheet package footnote: FG256 and FG484 are footprint-compatible packages, but the FG896 is a distinct footprint - do not assume family-wide footprint interchangeability. Keep configuration and JTAG balls routed away from high-slew I/O to protect flash configuration integrity during reprogramming.
The FG896 (no I suffix) is a commercial-grade part rated 0 C to +70 C; sourcing it for industrial builds is a frequent error - order A3PE3000-FG896I instead, which is the same footprint. The FG prefix is the non-green package; for RoHS/lead-free production lines specify the FGG896. Also confirm speed-grade suffix on purchase orders, since pricing and timing closure results differ across family speed grades.
Compliance Information
Per ProASIC3E datasheet ordering information, the G in the part number indicates RoHS-compliant green packages; this FG896 (no G) is the standard package. The A3PE3000-FGG896 is the RoHS-compliant equivalent.
